Analysis of the plastic deformation in aluminium metallizations of Al<inf>2</inf>O<inf>3</inf>-based DAB substrates

Abstract

AcknowledgmentsThe presented results be a part of the project "Investigations of a power module design for high thermal stress applications in automotive, aerospace and space -HiT -Modul". The project is founded by the federal ministry of research and education Germany and is a part of the program "Power Electronics for Energy Efficiency Enhancements". AbstractDAB are a new kind of substrates in which the copper layer was replaced by an aluminum layer. In [1] a increase of the roughness of these aluminum layer was observed during thermal cycling tests. A similar effect was observed during power cycling tests in [2,3]. This paper will discuss this effect with experimental results and Finite Element (FEM) simulations.