Analytical Models of Passive Linear Structures in Printed Circuit Boards

Abstract

Analytical models for passive linear structures, like metallic traces, vias, are proposed for simulations at the package and Printed circuit board (PCB) levels. In the proposed method, traces are modeled based on the transmission line theory, whereas the vias are described by the parallel‐plate impedance and several equivalent circuits elements. The proposed models can be applied to efficiently simulate composed passive linear structures. Several scenarios are analyzed including traces with two or three width, traces routed into different layers and interconnects commonly used in PCBs. The results of the models are compared with those from the full‐wave simulations and experiments. An improvement on the computation speed has been observed with respect to the full‐wave simulations at the effective range of models. In our measurements, a compensation approach of impedance mismatch in parameter measurements is analyzed and calculated, which could significantly simplify the experimental process.

Circuit Modeling and Performance Analysis of GNR@SWCNT Bundle Interconnects

“…As shown in Fig. 1, the equivalent RLC circuit model is considered for evaluating CNT or GNR interconnects [16]. and are the driver resistance and capacitance, is the load capacitance, is the contact resistance, and , , and are per-unit-length (p.u.l.)…”

“…According to [20], the capacitance of the GNR@SWCNT bundle is approximately same with the capacitance value for Cu wire with the same cross-dimensions. Therefore, is extracted using ANSYS Maxwell, with the parameter settings listed in Table 1 [16], and .…”

A Novel Wideband Wilkinson Pulse Combiner with Enhanced Low Frequency Isolation

“…High port isolation can be achieved by fully differential and integrated transformer as illustrated in [18]. And the port isolation of the combiner can also be improved with the aid of metamaterial [19]. Nevertheless, the above methods are only suitable for single-section Wilkinson combiner because the added structure are usually large in dimensions and hence are not suitable for integration of multi-section WPC.…”