2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and 2023
DOI: 10.1109/eurosime56861.2023.10100843
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Anand model calibration for SAC305 solder joints based on the evolution of the shear stress and strain hysteresis loops for different thermal cycling conditions

Jean-Baptiste Libot
1
,
Zoé Bussière
2
,
Lara Mahfouz
3
et al.
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