“…Regarding the crack tip concentration, Puls has assumed that it would be lowered to the heating solvus or TSSD [22,23]. Kim's model also demonstrates that it is reduced to the TSSD [2][3][4][5][6][7]. However, by claiming that the TSSP would not change with stresses, the authors insist that the crack tip solubility would correspond to the TSSP, not to the TSSD [1].…”