Annealing Effects on the Structural Properties of Gold Films on Si by the RF Magnetron Sputtering

Lee, Kyung Chul; Kim, Nam Ho; Kim, Hyoun Woo

doi:10.4028/www.scientific.net/msf.475-479.3923

Cited by 6 publications

(2 citation statements)

References 7 publications

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“…For example, Lee K. et al reported severe hillock formation and structures decrease in sputtered gold thin films on Si substrate after annealing at 600 and 700 °C. [ 64 ]…”

Section: Resultsmentioning

confidence: 99%

“…For example, Lee K. et al reported severe hillock formation and structures decrease in sputtered gold thin films on Si substrate after annealing at 600 and 700 °C. [64] To further explore the impact of hillock formation on reliability and electrical behavior, future experiments such as long-term thermal cycling and thermal shocking will be conducted, and more complex device structures such as metal-insulator-metal capacitor where the gold is not on the surface will be fabricated and tested, and the results will be discussed in a forthcoming publication.…”

Section: Hillocksmentioning

confidence: 99%

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Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High‐Temperature Applications

et al. 2023

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There is a growing interest in the development of microelectronics that can perform reliably and robustly at temperatures above 300 °C. Such devices require stable thermal properties, low thermal drift, and thermal cycling resistance. Conventional hybrid circuit technology demonstrates high‐temperature packages, but the high costs and lead time are significant drawbacks. In contrast, additive manufacturing processes, including aerosol jet printing (AJP), offer cost and time benefits, as well as 3D structures and embedded features. However, the properties and reliability of additive packaging materials at extreme temperatures are not well known. Herein, the reliability at temperatures up to 750 °C in terms of electrical performance and mechanical strength of aerosol jet printed gold thick films onto ceramic substrates are assessed. Thermal coefficient of resistance of printed gold films is measured. The electrical resistance stability and leakage current of printed gold structures are also characterized during over 100 h of aging at temperatures up to 750 °C. Finally, the mechanical adhesion strength of the printed gold films is evaluated after aging for 100 h at temperatures up to 750 °C. The adhesion of the printed gold to the ceramic substrates remains high after aging, very stable resistances and minimal leakage currents have been observed.

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“…For example, Lee K. et al reported severe hillock formation and structures decrease in sputtered gold thin films on Si substrate after annealing at 600 and 700 °C. [ 64 ]…”

Section: Resultsmentioning

confidence: 99%

Section: Hillocksmentioning

confidence: 99%

Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High‐Temperature Applications

et al. 2023

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Unraveling Thermodynamic and Kinetic Contributions to the Stability of Doped Nanocrystalline Alloys using Nanometallic Multilayers

et al. 2022

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Targeted doping of grain boundaries is widely pursued as a pathway for combating thermal instabilities in nanocrystalline metals. However, certain dopants predicted to produce grain‐boundary‐segregated nanocrystalline configurations instead form small nanoprecipitates at elevated temperatures that act to kinetically inhibit grain growth. Here, thermodynamic modeling is implemented to select the Mo–Au system for exploring the interplay between thermodynamic and kinetic contributions to nanostructure stability. Using nanoscale multilayers and in situ transmission electron microscopy thermal aging, evolving segregation states and the corresponding phase transitions are mapped with temperature. The microstructure is shown to evolve through a transformation at lower homologous temperatures (<600 °C) where solute atoms cluster and segregate to the grain boundaries, consistent with predictions from thermodynamic models. An increase in temperature to 800 °C is accompanied by coarsening of the grain structure via grain boundary migration but with multiple pinning events uncovered between migrating segments of the grain boundary and local solute clustering. Direct comparison between the thermodynamic predictions and experimental observations of microstructure evolution thus demonstrates a transition from thermodynamically preferred to kinetically inhibited nanocrystalline stability and provides a general framework for decoupling contributions to complex stability transitions while simultaneously targeting a dominant thermal stability regime.

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Low temperature crystallized voltage tunable Bi1.5Cu Mg1−Nb1.5O7 thin films capable of integration with Au electrode

Ning

Xia

et al. 2012

Ceramics International

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Annealing Effects on the Structural Properties of Gold Films on Si by the RF Magnetron Sputtering

Cited by 6 publications

References 7 publications

Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High‐Temperature Applications

Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High‐Temperature Applications

Unraveling Thermodynamic and Kinetic Contributions to the Stability of Doped Nanocrystalline Alloys using Nanometallic Multilayers

Low temperature crystallized voltage tunable Bi1.5Cu Mg1−Nb1.5O7 thin films capable of integration with Au electrode

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