Antioxidant-Based Phase-Change Thermal Interface Materials with High Thermal Stability

Abstract

This work provides phase-change thermal interface materials (TIMs) with high thermal stability and high heat of fusion. They are based on antioxidants mainly in the form of hydrocarbons with linear segments. The thermal stability is superior to paraffin wax and four commercial phase-change materials (PCMs). The use of 98.0 wt.% thiopropionate antioxidant (SUMILIZER TP-D) with 2.0 wt.% sterically half-hindered phenolic antioxidant (GA80) as the matrix and the use of 16 vol.% boron nitride particles as the solid component give a PCM with a 100°C lifetime indicator of 5.3 years, in contrast to 0.95 year or less for the commercial PCMs. The heat of fusion is much higher than those of commercial PCMs; the values for antioxidants with nonbranched molecular structures exceed that of wax; the value for one with a branched structure is slightly below that of wax. The phase-change properties are degraded by heating at 150°C much less than those of the commercial PCMs. The stability of the heat of fusion upon phase-change cycling is also superior. The viscosity is essentially unaffected by heating at 150°C. Commercial PCMs give slightly lower values of the thermal contact conductance for the case of rough (12 lm) mating surfaces, in spite of the lower values of the bond-line thickness.

Novel nanostructured thermal interface materials: a review

“…A summarised comparison of recent TIM results is shown in Figure 7 together with some commercial compounds [146,200]. It contains selected reports in which thermal interface resistance measurements have been done at a given BLT.…”

Architecting Three-Dimensional Networks in Carbon Nanotube Buckypapers for Thermal Interface Materials

“…As the power density of microelectronic devices has been increasing at a noticeable rate, chemically stable and high-performance thermal interface materials (TIMs) to dissipate heat efficiently from the devices are urgently needed. , In general, the commercialized TIMs are often categorized into four groups: solder, thermal paste, phase-change material, and sheet material, all of which can be used to fill gaps between two hard surfaces, such as silicon or sapphire substrates for electronic devices and metal plates for heat sink (or heat spreader), in order to minimize the thermal contact resistance between them. However, TIMs still face challenges to meet the increasing requirements for high-power electronic devices in terms of long-term reliability, high thermal conductivity, low thermal contact resistance, and mechanical fatigue resistance.…”

Performance of Thermal Interface Materials

“…A special type of TIM is in the form of a phase-change material (PCM). [37,[41][42][43][44][45][46] This type of TIM was first reported by Liu and Chung in 2001. [42] The phase change involves melting, which occurs at temperatures not much above room temperature.…”