APDS modified several bisphenol A polyimides with low dielectric constant under high frequency

Li, Heming; Wang, Xinming; Gong, Yuze; Zhao, Hongbin; Liu, Zhaobin; Tao, Lin; Dastan, Davoud; Ma, Ke; Hu, Zhizhi; Sun, Mingming

doi:10.1007/s10965-023-03788-2

Cited by 4 publications

(2 citation statements)

References 47 publications

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“…The C-N bond peaks can be observed at 1380 cm −1 . The-CF 3 bands from 6FAPB can be observed at 1296 cm −1 [ 45 ]. The S=O double bonds from the sulfone groups can be observed from 1250 −1 to 1350 cm −1 at the last two lines.…”

Section: Resultsmentioning

confidence: 99%

Adhesion and Transparency Enhancement between Flexible Polyimide-PDMS Copolymerized Film and Copper Foil for LED Transparent Screen

Wang,

Zhao,

et al. 2024

Polymers

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With the increasing demand for innovative electronic products, LED transparent screens are gradually entering the public eye. Polyimide (PI) materials combine high temperature resistance and high transparency, which can be used to prepare flexible copper-clad laminate substrates. The physical and chemical properties of PI materials differ from copper, such as their thermal expansion coefficients (CTEs), surface energy, etc. These differences affect the formation and stability of the interface between copper and PI films, resulting in a short life for LED transparent screens. To enhance PI-copper interfacial adhesion, aminopropyl-terminated polydimethylsiloxane (PDMS) can be used to increase the adhesive ability. Two diamine monomers with a trifluoromethyl structure and a sulfone group structure were selected in this research. Bisphenol type A diether dianhydride is a dianhydride monomer. All three of the above monomers have non−coplanar structures and flexible structural units. The adhesion and optical properties can be improved between the interface of the synthesized PI films and copper foil. PI films containing PDMS 0, 1, 3, and 5 wt% were analyzed using UV spectroscopy. The transmittance of the PI-1/3%, PI-1/5%, PI-2/3%, and PI-2/5% films were all more than 80% at 450 nm. Meanwhile, the Td 5% and Td 10% heat loss and Tg temperatures decreased gradually with the increase in PDMS. The peel adhesion of PI-copper foil was measured using a 180° peel assay. The effect of PDMS addition on peel adhesion was analyzed. PIs-3% films had the greatest peeling intensities of 0.98 N/mm and 0.85 N/mm.

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Section: Resultsmentioning

confidence: 99%

Adhesion and Transparency Enhancement between Flexible Polyimide-PDMS Copolymerized Film and Copper Foil for LED Transparent Screen

Wang,

Zhao,

et al. 2024

Polymers

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“…The molar ratio of DPT/dianhydride/CED is 1:1:0.1-0.4. The PI/CED host guest inclusion films were prepared according to the conventional two-step thermal method, as mentioned in our past work [38,39]. 2 [35][36][37].…”

Section: Preparation Of Crown Ether Diamine (Ced)mentioning

confidence: 99%

Crown Ether Copolymerized Polyimide Film: Enhanced Mechanical, Thermal Properties and Low Dielectric Constant under High Frequency

Li,

Wang,

Ding

et al. 2024

Polymers

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Polymer materials with a low dielectric constant and low dielectric loss have the potential to be applied to high-frequency signal transmissions, such as mobile phone antennas and millimeter wave radars. Two types of diamines, 4,4′-diamino-p-tetraphenyl (DPT) and crown ether diamine (CED), were prepared for ternary copolymerization with BPDA in this study. Cross-links with molecular chains were formed, increasing molecular chain distance by utilizing rings of CED. The MPI films exhibit a good thermal performance with the increase in CED addition, with Tg > 380 °C and CTE from −4 × 10−6 K−1 to 5 × 10−6 K−1. The Young’s modulus can reach 8.6 GPa, and the tensile strength is above 200 MPa when 5% and 7% CED are introduced. These MPI films exhibit good mechanical performances. The dielectric constant of PI−10% film can go as low as 3.17. Meanwhile, the relationship between dielectric properties and molecular structure has been demonstrated by Molecular Simulation (MS). PI molecules are separated by low dielectric groups, resulting in a decrease in the dielectric constant.

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High-frequency 5G substrate: Low dielectric biphenyl polyimide with low CTE and high thermal stability

Li,

Wei,

Wang

et al. 2024

Materials Today Advances

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APDS modified several bisphenol A polyimides with low dielectric constant under high frequency

Cited by 4 publications

References 47 publications

Adhesion and Transparency Enhancement between Flexible Polyimide-PDMS Copolymerized Film and Copper Foil for LED Transparent Screen

Adhesion and Transparency Enhancement between Flexible Polyimide-PDMS Copolymerized Film and Copper Foil for LED Transparent Screen

Crown Ether Copolymerized Polyimide Film: Enhanced Mechanical, Thermal Properties and Low Dielectric Constant under High Frequency

High-frequency 5G substrate: Low dielectric biphenyl polyimide with low CTE and high thermal stability

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