Application and RF Performance of Integrated Resistor Structures on Non-Planar Topologies in Micro-Machined Silicon Packages for Transmitter Optical Subassemblies

Winter, Matthias; Hauffe, R.; Kilian, A.; Runge, Patrick; Reznik, D.; Greisen, Christoffer; Weichel, S.; Shiv, Lior; Heschel, M.

doi:10.1109/ectc.2006.1645864

56th Electronic Components and Technology Conference 2006

DOI: 10.1109/ectc.2006.1645864

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Application and RF Performance of Integrated Resistor Structures on Non-Planar Topologies in Micro-Machined Silicon Packages for Transmitter Optical Subassemblies

Matthias Winter¹,

R. Hauffe²,

A. Kilian³

et al.

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Processing and Performance of Broadband Integrated Resistor Structures on non-Planar Topologies in Hermetic Silicon Enclosure with Vertical Micro Vias

Greisen¹,

Hauffe²,

Shiv³

et al.

56th Electronic Components and Technology Conference 2006

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Application and RF Performance of Integrated Resistor Structures on Non-Planar Topologies in Micro-Machined Silicon Packages for Transmitter Optical Subassemblies

Cited by 3 publications

References 3 publications

Processing and Performance of Broadband Integrated Resistor Structures on non-Planar Topologies in Hermetic Silicon Enclosure with Vertical Micro Vias

Processing and Performance of Broadband Integrated Resistor Structures on non-Planar Topologies in Hermetic Silicon Enclosure with Vertical Micro Vias

Silicon micro machined hermetic packaging technology for optical subassemblies

Nonlinear Effects in Ultralong Semiconductor Optical Amplifiers for Optical Communications: Physics and Applications

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