Application of Pencil Lead Break (PLB) Point Source in the Detection of Interfacial Defects in Adhesive Bonds

Abstract

The presence of kissing bonds (zero-thickness disbond) along the interface of an adhesive bond is highly detrimental to its strength and longevity. The detection of these kind of defects has previously been attempted using several techniques such as ultrasonic, infrared thermography, and X-ray spectroscopy, etc. This study aims to assess the effectiveness of pencil lead break (PLB) tests as a source in detecting the defects distributed along the interface of an adhesive bond. The defects were introduced artificially using polytetrafluoroethylene (PTFE) spray along one of the interfaces of the adhesive bond fabricated with aluminium plates bonded with an epoxy adhesive. Three different interfacial defect area percentages, 0%, 25% and 40% and three adhesive layer thicknesses (i.e., 0.1 mm, 0.25 mm, and 0.5 mm) were considered. The PLB tests were conducted, and the recorded signals were analysed to assess the variation of AE features with the defect area percentage and adhesive layer thicknesses. Different source-sensor location configurations were also considered. The 200 kHz-highpass component of the recorded signals was found to be sensitive to the presence of the interfacial defects. The duration above a chosen threshold was found to be the distinguishing factor between the different defective specimens. Of the different sensor-source configurations tried, the configurations with the PLB on the 0.5 mm side were seen to be sensitive to the presence of defects.