2013 Conference on Lasers &Amp; Electro-Optics Europe &Amp; International Quantum Electronics Conference CLEO EUROPE/IQEC 2013
DOI: 10.1109/cleoe-iqec.2013.6801254
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Application specific photonic integrated circuits for telecommunications

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Cited by 7 publications
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“…Another development trend of chips involves the hybrid integration of electronics and photonics. Many photonics platforms, such as III-V [6][7][8] , Si3N4 [9][10][11] , lithium niobite [12][13][14] , and SOI, are available for communication, sensing, and other specific applications. Silicon photonics are fabricated in the same manner as electric ICs via CMOS technology.…”
Section: Introductionmentioning
confidence: 99%
“…Another development trend of chips involves the hybrid integration of electronics and photonics. Many photonics platforms, such as III-V [6][7][8] , Si3N4 [9][10][11] , lithium niobite [12][13][14] , and SOI, are available for communication, sensing, and other specific applications. Silicon photonics are fabricated in the same manner as electric ICs via CMOS technology.…”
Section: Introductionmentioning
confidence: 99%