2008 IEEE/ACM International Conference on Computer-Aided Design 2008
DOI: 10.1109/iccad.2008.4681624
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Area-I/O flip-chip routing for chip-package co-design

Abstract: Abstract-The area-I/O flip-chip package provides a high chip-density solution to the demand of more I/O's in VLSI designs; it can achieve smaller package size, shorter wirelength, and better signal and power integrity. In this paper, we introduce the routing problem for chip and package co-design and present the first work in the literature to handle the multiple Re-Distribution Layer (RDL) routing problem for flip-chip designs, considering pin and layer assignment, total wirelength minimization, and chip-pack… Show more

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Cited by 8 publications
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