Aspects of micro structuring low temperature co-fired ceramic (LTCC) for realisation complex 3D objects by embossing

Andrijasevic, D.; Smetana, Walter; Zehetner, Johann; Zoppel, S.; Brenner, W.

doi:10.1016/j.mee.2007.01.152

Cited by 31 publications

(24 citation statements)

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“…Rabe et al (2007) reviewed the LTCC manufacturing processes and demonstrated the feasibility of embossing on ceramic green tapes. Andrijasevic et al (2007) and De Torres (2007) demonstrated micro wedges and fluidic channels embossed on LTCC green tapes. However, there is no report covering the systematic process investigations on micro embossing of ceramic green substrates.…”

Section: Introductionmentioning

confidence: 99%

Microstructure formation on low temperature co-fired ceramic green substrates using micro embossing

et al. 2008

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Microstructures were formed on low temperature co-fired ceramic (LTCC) green substrates with high fidelity using micro embossing. The impact of embossing temperature and pattern density against the embossed profiles was investigated. The increase in pattern density resulted in a macro deformation in addition to embossed micro-depth. The macro deformation can be decreased by careful management of pattern density as well as pressure ramp and temperature ramp. The embossed ceramic green substrates were debinded and co-fired with a supplier-recommended process; the dimension shrinkage of embossed channels after co-firing ranges from 20 to 22% in depth and from 10 to 13% in width. The achievements of this investigation demonstrated that micro embossing is a promising process for fabricating ceramic-based microstructures and devices, including embedded cavities and channels.

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Section: Introductionmentioning

confidence: 99%

Microstructure formation on low temperature co-fired ceramic green substrates using micro embossing

et al. 2008

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“…Green ceramic tape can be easily and precisely machined in order to fabricate channels, cavities, chambers or other microfluidic structures [11,12]. Precise microfluidic, micromechanical and microelectronic structures with characteristic dimension in the range from 50 µm to single centimeters can be fabricated in green LTCC tape using hot embossing [13,14], laser cutting [15][16][17], mechanical milling [8,18] techniques. Moreover, a fired LTCC material is chemically resistant and chemically inactive [19,20].…”

Section: Introductionmentioning

confidence: 99%

Integration of Optoelectronic Components with LTCC (Low Temperature Co-Fired Ceramic) Microfluidic Structure

Malecha¹

2011

Metrology and Measurement Systems

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Investigations on integration of optoelectronic components with LTCC (low temperature co-fired ceramics) microfluidic module are presented. Design, fabrication and characterization of the ceramic structure for optical absorbance is described as well. The geometry of the microfluidic channels has been designed according to results of the CFD (computational fluid dynamics) analysis. A fabricated LTCC-based microfluidic module consists of an U-shaped microchannel, two optical fibers and integrated light source (light emitting diode) and photodetector (light-to-voltage converter). Properties of the fabricated microfluidic system have been investigated experimentally. Several concentrations of potassium permanganate (KMnO 4 ) in water were used for absorbance/transmittance measurements. The test has shown a linear detection range for various concentrations of heavy metal ions in distilled water. The fabricated microfluidic structure is found to be a very useful system in chemical analysis.

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“…Several research groups have demonstrated the feasibility of patterning green ceramic tapes using simultaneous embossing, i.e. to emboss an overall panel simultaneously with a rigid mold; micro pillars and wedges have been patterned on green substrates (Andrijasevic et al 2007;Rabe et al 2007). However, being composed of ceramic-based powders and polymeric additives, green ceramic tapes are flexible with low strength.…”

Section: Introductionmentioning

confidence: 99%

A micro roller embossing process for structuring large-area substrates of laminated ceramic green tapes

et al. 2008

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This paper presents a micro roller embossing process for patterning large-area substrates of laminated green ceramic tapes. The aim of this research is to develop a large-area microstructure formation technique for green ceramic substrates using a thermal roller laminator, which is compatible with screen printing apparatus. A thin film nickel mold was developed via photolithographic patterning and nickel electroplating on a 75-lm-thick nickel film. The mold had an effective panel size of 150 mm 9 150 mm with the height of plated protrusive patterns being about 38 lm. Formation of micro patterns was successfully demonstrated over the whole panel area on laminated green ceramic tapes using roller embossing. Micro patterns for inductors, heaters as well as interconnection with 50 lm line-width were embossed on green ceramic substrates. By means of tuning process parameters including roller temperature, applied pressure and feeding speed, we have demonstrated that micro roller embossing is a promising method for patterning large-area green ceramic substrates.

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Aspects of micro structuring low temperature co-fired ceramic (LTCC) for realisation complex 3D objects by embossing

Cited by 31 publications

References 1 publication

Microstructure formation on low temperature co-fired ceramic green substrates using micro embossing

Microstructure formation on low temperature co-fired ceramic green substrates using micro embossing

Integration of Optoelectronic Components with LTCC (Low Temperature Co-Fired Ceramic) Microfluidic Structure

A micro roller embossing process for structuring large-area substrates of laminated ceramic green tapes

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