Assembly technology across multiple length scales from the micro-scale to the nano-scale

Skidmore, George D.; Ellis, M.; Geisberger, A.; Tsui, K.; Tuck, K.; Saini, Rahul; Udeshi, Tushar; Nolan, Michael; Stallcup, Richard E.; Ehr, Jim Von

doi:10.1109/mems.2004.1290653

Cited by 13 publications

(10 citation statements)

References 10 publications

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“…Serial microassembly definitely provides an excellent technique to achieve complicated three dimensional structures capable of out-of-plane motion. It is also the technique of choice for precise assembly of complicated microparts as is required in applications like the electron lens for a mini-SEM [17]. As 'system on a chip' applications begin to encompass various sensors and actuators on a single chip along with the integrated circuits, this technique could prove to be an essential manufacturing tool.…”

Section: Discussionmentioning

confidence: 99%

Methods and Characterization of Pick and Place Microassembly

Subramaniam

Pister

2006

Microelectromechanical Systems

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Microassembly of MEMS structures using serial pick-and place has been demonstrated as a method for constructing complex three-dimensional microstructures. A new methodology to perform pick-and-place microassembly using a 3 DOF micromanipulator is demonstrated here. In this approach, the "pick" operation is performed on one chip, while the "place" operation is performed on a second chip mounted orthogonally to it under a microscope. This removes the need for the rotation of parts during assembly as required in previous works thus creating a significantly simpler assembly process. Also new in this work is the characterization of the contact resistance and the rigidity of assembled microstructures. The contact resistance of assembled microparts coated with 30nm of gold is measured to be approximately 12Ωusing a four-point measurement. The force required to pull out a micropart from a socket (into which it is assembled) is characterized along all three axes and found to be over 5mN in each case. The relationship between the force taken to engage the sockets and the force to pull out a micropart is measured to be linear. An electrostatic inchworm motor with extended range and a vertical thermal actuator are demonstrated which are manufactured using microassembly. Thus this assembly process with mechanically rigid assemblies is shown to have a number of potential applications.

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Section: Discussionmentioning

confidence: 99%

Methods and Characterization of Pick and Place Microassembly

Subramaniam

Pister

2006

Microelectromechanical Systems

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“…Microassembly can be performed using pick-and-place macroscale robotic micromanipula-tors (Dechev et al, 2004; Skidmore et al, 2004), distributed manipulation (Böhringer et al, 1994; Bohringer et al, 1999; Suh et al, 1999), or via parallel but less controllable self-assembly (Whitesides & Grzybowski, 2002; Rothemund, 2000; Liang et al, 2004)…”

Section: Related Workmentioning

confidence: 99%

“…Pick-and place assembly using macroscale robotic micromanipulators has been shown to successfully assemble several microstructures (Skidmore et al, 2004). However, the actuator mass is several orders of magnitude larger than its payload.…”

Section: Related Workmentioning

confidence: 99%

Planning and control for microassembly of structures composed of stress-engineered MEMS microrobots

Donald

Levey

Paprotny

et al. 2013

The International Journal of Robotics Research

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We present control strategies that implement planar microassembly using groups of stress-engineered MEMS microrobots (MicroStressBots) controlled through a single global control signal. The global control signal couples the motion of the devices, causing the system to be highly underactuated. In order for the robots to assemble into arbitrary planar shapes despite the high degree of underactuation, it is desirable that each robot be independently maneuverable (independently controllable). To achieve independent control, we fabricated robots that behave (move) differently from one another in response to the same global control signal. We harnessed this differentiation to develop assembly control strategies, where the assembly goal is a desired geometric shape that can be obtained by connecting the chassis of individual robots. We derived and experimentally tested assembly plans that command some of the robots to make progress toward the goal, while other robots are constrained to remain in small circular trajectories (closed-loop orbits) until it is their turn to move into the goal shape. Our control strategies were tested on systems of fabricated MicroStressBots. The robots are 240–280 μm × 60 μm × 7–20 μm in size and move simultaneously within a single operating environment. We demonstrated the feasibility of our control scheme by accurately assembling five different types of planar microstructures.

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“…Thus, work has focused on the development of more complex 3D nanomanipulation systems (up to 16 DOF) which consist of one or more probes that have been integrated into scanning electron microscopes (SEM) for real-time visual feedback (Yu et al, 1999;Guthold et al, 2000;Dong et al, 2001;Fukuda et al, 2003;Skidmore et al, 2004;Arai et al, 2004).…”

Section: Manipulation Of Carbon Nanotubesmentioning

confidence: 99%

A review of research in the field of nanorobotics.

Sierra¹,

Weir²,

Jones³

2005

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This report highlights the findings of an extensive review of the literature in the area of nanorobotics. The main goal of this midyear LDRD effort is to survey and identify accomplishments and advancements that have been made in this relatively new and emerging field. As a result, it may be determined what routes in the area of nanorobotics are scientifically plausible and technically useful so that the Intelligent Systems and Robotics Center can position itself to play a role in the future development of nanotechnology. 4This page intentionally left blank 5

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Assembly technology across multiple length scales from the micro-scale to the nano-scale

Cited by 13 publications

References 10 publications

Methods and Characterization of Pick and Place Microassembly

Methods and Characterization of Pick and Place Microassembly

Planning and control for microassembly of structures composed of stress-engineered MEMS microrobots

A review of research in the field of nanorobotics.

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