Atomic oxygen durable ultra-black polyimide nanocomposite films in solar spectrum

Qian, Min; Liu, Gang; Zhou, Bo; Xuan, Xiao Yang; Niu, Yue; Gong, Shang

doi:10.1016/j.polymdegradstab.2020.109133

Cited by 22 publications

(10 citation statements)

References 42 publications

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“…The PI (PMDA-ODA) film has been thought to be good candidate as the protecting components for the LEO spacecrafts due to the excellent combined properties. However, the in-orbit experimental results performed in the LEO spacecrafts indicated that obvious mechanical property deterioration and weight loss occurred in the standard PI (PMDA-ODA) films, due to the high energy up to 5 eV during the impact with the AO species at the cruising speed of 7.8 km/s [5][6][7][8][9][10]. This energy is usually higher than the dissociation energy of the chemical bonds in the PI (PMDA-ODA) films, such as C-N (3.2 eV), C-C (3.9 eV), and so on [11].…”

Section: Introductionmentioning

confidence: 99%

Preparation and Properties of Intrinsically Atomic-Oxygen Resistant Polyimide Films Containing Polyhedral Oligomeric Silsesquioxane (POSS) in the Side Chains

Zhang

Guo

et al. 2020

Polymers

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The relatively poor atomic-oxygen (AO) resistance of the standard polyimide (PI) films greatly limits the wide applications in low earth orbit (LEO) environments. The introduction of polyhedral oligomeric silsesquioxane (POSS) units into the molecular structures of the PI films has been proven to be an effective procedure for enhancing the AO resistance of the PI films. In the current work, a series of POSS-substituted poly (pyromellitic anhydride-4,4′-oxydianiline) (PMDA-ODA) films (POSS-PI) with different POSS contents were synthesized via a POSS-containing diamine, N-[(heptaisobutyl-POSS)propyl]-3,5-diaminobenzamide (DABA-POSS). Subsequently, the effects of the molecular structures on the thermal, tensile, optical, and especially the AO-erosion behaviors of the POSS-PI films were investigated. The incorporation of the latent POSS substituents decreased the thermal stability and the high-temperature dimensional stability of the pristine PI-0 (PMDA-ODA) film. For instance, the PI-30 film with the DABA-POSS content of 30 wt% in the film exhibited a 5% weight loss temperature (T5%) of 512 °C and a coefficient of linear thermal expansion (CTE) of 54.6 × 10−6/K in the temperature range of 50–250 °C, respectively, which were all inferior to those of the PI-0 film (T5% = 574 °C; CTE = 28.9 × 10−6/K). In addition, the tensile properties of the POSS-containing PI films were also deteriorated, to some extent, due to the incorporation of the DABA-POSS components. The tensile strength (TS) of the POSS-PI films decreased with the order of PI-0 > PI-10 > PI-15 > PI-20 > PI-25 > PI-30, and so did the tensile modulus (TM) and the elongations at break (Eb). PI-30 showed the TS, TM, and Eb values of 75.0 MPa, 1.55 GPa, and 16.1%, respectively, which were all lower than those of the PI-0 film (TS = 131.0 MPa, TM = 1.88 GPa, Eb = 73.2%). Nevertheless, the incorporation of POSS components obviously increased the AO resistance of the PI films. All of the POSS-PI films survived from the AO exposure with the total fluence of 2.16 × 1021 atoms/cm2, while PI-0 was totally eroded under the same circumstance. The PI-30 film showed an AO erosion yield (Es) of 1.1 × 10−25 cm3/atom, which was approximately 3.67% of the PI-0 film (Es = 3.0 × 10−24 cm3/atom). Inert silica or silicate passivation layers were detected on the surface of the POSS-PI films after AO exposure, which efficiently prevented the further erosion of the under-layer materials.

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Section: Introductionmentioning

confidence: 99%

Preparation and Properties of Intrinsically Atomic-Oxygen Resistant Polyimide Films Containing Polyhedral Oligomeric Silsesquioxane (POSS) in the Side Chains

Zhang

Guo

et al. 2020

Polymers

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“…Black PI (BPI) films represent a class of special PI films characterized by the black appearance, which have been widely used in the fabrication of flexible printed circuit board (FPCB) in semiconductor industry, as voice coils in loudspeakers, or as thermal control components in aerospace vehicles [13][14][15]. The black appearance designed for the BPI films for the above-mentioned applications is mainly based on the consideration of shielding (intellectual property rights protection, etc.…”

Section: Introductionmentioning

confidence: 99%

Preparation and Properties of Intrinsically Black Polyimide Films with CIE Lab Color Parameters Close to Zero and High Thermal Stability for Potential Applications in Flexible Printed Circuit Boards

et al. 2022

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Black polymer films with high thermal stability are highly desired in flexible electrical and electronic fields. Conventional black polymer films based on high-temperature resistant polymers and black inorganic dyes are usually suffered from the poor electrical and tensile properties. In the current work, a series of intrinsically black polyimide (BPI) films with International Commission on Illumination (CIE) Lab optical parameters close to zero and high thermal stability have been designed and prepared. For this purpose, an electron-rich aromatic diamine, 4,4′-iminodianiline (NDA), was copolymerized with 1,4-phenylenediamine (PDA) and 3,3′,4,4′-biphenyltetracarboxylic dianhydride (sBPDA) to afford a series of poly(amic acid) (PAA) solutions, which were then thermally dehydrated to provide the final BPI films at elevated temperatures up to 400 °C in air. The molar fraction of NDA in the total diamine monomers was 0 for BPI-0 (sBPDA-PDA), 10% for BPI-1, 20% for BPI-2, 30% for BPI-3, 40% for BPI-4, 50% for BPI-5, and 100% for BPI-6. For comparison, two referenced polyimide (PI) films, including PI-ref1 and PI-ref2, were prepared according to a similar procedure. The former was derived from pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (ODA) and the latter was from PMDA and NDA. The BPI films exhibited an increasing degree of blackness with the increasing contents of NDA units in the polymer films. For example, the BPI-6 (sBPDA-NDA) film exhibited the optical transmittance of 1.4% at a wavelength of 650 nm (T650), which was obviously lower than those of PI-ref1 (T650 = 74.6%) and PI-ref2 (T650 = 3.6%). In addition, the BPI-6 film showed the CIE Lab parameters of 0.39 for L*, 2.65 for a*, 0.66 for b*, and haze of 1.83, which was very close to the criterion of “pure blackness” for polymer films (L* = a* = b* = 0). At last, incorporation of the NDA units in the rigid-rod BPI-0 (BPDA-PDA) film slightly deteriorated the high-temperature dimensional stability of the derived BPI films. BPI-6 film showed a linear coefficient of thermal expansion (CTE) value of 34.8 × 10−6/K in the temperature range of 50 to 250 °C, which was higher than those of the BPI-0 (CTE = 12.3 × 10−6/K), PI-ref1 (CTE = 29.5 × 10−6/K), and PI-ref2 (CTE = 18.8 × 10−6/K) films. Nevertheless, the BPI films maintained good thermal stability with the 5% weight loss temperatures (T5%) higher than 590 °C, and the glass transition temperatures (Tg) higher than 340 °C.

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“…To date, the approach for preparing BPI has been to add various light-shielding substances to a polyamic acid (PAA) matrix, such as carbon black, − graphene, , carbon nanotubes, black BR (C.I. Solvent Black 34), metal oxide, or other inorganic or organic black fillers. , However, the introduction of carbon materials and metal oxides dramatically reduces the electrical insulation performance of PI films and inevitably damages their mechanical properties due to an uneven distribution and pinholes, and composites with organic compounds lower the heat resistance of PI. , Although composite BPIs are commercially available, their applications are restricted in certain scenarios. Therefore, the development of the intrinsically BPI film is an urgent requirement.…”

Section: Introductionmentioning

confidence: 99%

Intrinsically Black Polyimide with Retained Insulation and Thermal Properties: A Black Anthraquinone Derivative Capable of Linear Copolymerization

et al. 2021

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Black polyimide (BPI) is increasingly in demand for the development of photoelectric devices in place of yellow transparent polyimide, but BPI doped with carbon black shows serious insulation and mechanical performance deficiencies due to pinholes and uneven dispersion. Intrinsically BPI has thus attracted increasing interest in science and industry. Anthraquinone derivatives have an ample high molar extinction coefficient (ε), and appending as many auxochromes (−OH and −NH2) as possible on the anthraquinone skeleton can extend its light absorption range, thereby achieving complete UV–visible light absorption. However, the greatest obstacle to its application in BPI is retaining the monomer bifunctionality to avoid gel formation. In this work, a linearly polymerizable anthraquinone derivative, 2,4,5,7-tetraamino-1,8-dihydroxyanthracene-9,10-dione (4NADA), has been developed. Structural analysis of this monomer bearing multiple active groups by 1H NMR, Fourier-transform infrared, and theoretical calculations has demonstrated that the auxochrome groups show different nucleophilic activities owing to the formation of intramolecular hydrogen bonds, such that only p-amino groups (2- and 7-positions) can participate in the polymerization reaction. Subsequently, 4NADA was copolymerized into a Kapton-type polyimide. We found that low-level introduction of 4NADA (4%) afforded a spectrally BPI film that maintained the electrical insulation and heat resistance properties of polyimide. This method, equivalent to embedding a black monomer in polyimide chains, has merits of economy, universality, process consistency, ready accessibility, and superior performance.

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Atomic oxygen durable ultra-black polyimide nanocomposite films in solar spectrum

Cited by 22 publications

References 42 publications

Preparation and Properties of Intrinsically Atomic-Oxygen Resistant Polyimide Films Containing Polyhedral Oligomeric Silsesquioxane (POSS) in the Side Chains

Preparation and Properties of Intrinsically Atomic-Oxygen Resistant Polyimide Films Containing Polyhedral Oligomeric Silsesquioxane (POSS) in the Side Chains

Preparation and Properties of Intrinsically Black Polyimide Films with CIE Lab Color Parameters Close to Zero and High Thermal Stability for Potential Applications in Flexible Printed Circuit Boards

Intrinsically Black Polyimide with Retained Insulation and Thermal Properties: A Black Anthraquinone Derivative Capable of Linear Copolymerization

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