2019
DOI: 10.1038/s41598-019-55967-1
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Author Correction: Epoxy toughening through high pressure and shear rate preprocessing

Abstract: An amendment to this paper has been published and can be accessed via a link at the top of the paper.

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Cited by 4 publications
(2 citation statements)
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“…4 Unfortunately, this attribute triggers the formation and spread of microcracks and defects while being processed and utilized, ultimately resulting in material breakdown and drastically reducing the lifespan of electronic equipment. 5 Moreover, accompanied by the miniaturization of power electronic equipment and components, insulating materials are required to withstand higher electric field intensity. 6 If the applied voltage surpasses the electrical breakdown strength of the materials, various forms of electrical damage can occur to the resin.…”
Section: Introductionmentioning
confidence: 99%
“…4 Unfortunately, this attribute triggers the formation and spread of microcracks and defects while being processed and utilized, ultimately resulting in material breakdown and drastically reducing the lifespan of electronic equipment. 5 Moreover, accompanied by the miniaturization of power electronic equipment and components, insulating materials are required to withstand higher electric field intensity. 6 If the applied voltage surpasses the electrical breakdown strength of the materials, various forms of electrical damage can occur to the resin.…”
Section: Introductionmentioning
confidence: 99%
“…Several toughening mechanisms for epoxy resins were observed in nanocomposites [14] or elastomer-modified epoxy resins [15], as reviewed before [16]. Eventual preprocessing of the epoxy under high pressure and shear rates [17] or controlled thermal curing [18] was able to improve the fracture toughness as a result of an increase in polymer chain length together with a reduction in crosslinking density.…”
Section: Introductionmentioning
confidence: 99%