Background of the titanium nitride deposition

Szikora, Bela

doi:10.1016/s0042-207x(98)00052-9

Cited by 8 publications

(4 citation statements)

References 3 publications

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“…In recent years, it has been gaining the increased attention of the scientific community for its applications in nano-electro-mechanical systems (NEMS) and in the etching process of dielectrics as a hard mask in complementary-metal-oxide-semiconductor (CMOS) device fabrication. In microelectronics instrumentation, it also finds application for its electrical characteristics and for its diffusion barrier properties [9][10][11][12][13][14][15][16]. TiN has a lustrous golden yellow colour due to which it has been used for decorative applications.…”

Section: Introductionmentioning

confidence: 99%

Study on the influence of nitrogen on titanium nitride in a dc post magnetron sputtering plasma system

Borah

Bailung

Pal

et al. 2008

J. Phys. D: Appl. Phys.

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The characteristics of direct current (dc) glow discharge plasma have been studied in a post magnetron device with an argon and nitrogen gas mixture. The introduction of nitrogen modifies the discharge leading to modifications of plasma parameters, transport mechanism and the cathode sheath. The electron energy distribution function, density and temperature profile are measured to characterize the discharge. Measured plasma potential profiles show the modification of the structure of the cathode sheath and confinement space variation. Optical emission spectroscopy is used to identify prominent transitions of the different species in the discharge. The discharge mode in argon undergoes a transition from metallic mode to reactive mode when nitrogen concentration exceeds argon.

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Section: Introductionmentioning

confidence: 99%

Study on the influence of nitrogen on titanium nitride in a dc post magnetron sputtering plasma system

Borah

Bailung

Pal

et al. 2008

J. Phys. D: Appl. Phys.

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“…Titanium nitride (TiN) ceramics are of interest given their excellent combination of both physical and mechanical properties, such as high strength, high heat resistance, high wear resistance, high corrosion resistance, good electrical conductivity, etc . These remarkable properties, in combination with its physical attributes (i.e., an attractive golden color) render TiN a promising candidate for a variety of applications that includes coatings on cutting tools, self‐heating crucibles, high‐temperature heterogeneous catalysts and coatings on jewelry products . Moreover, electronically conductive ceramics, such as porous TiN ceramics in particular, are of interest in other important potential applications.…”

Section: Introductionmentioning

confidence: 99%

“…[1][2][3] These remarkable properties, in combination with its physical attributes (i.e., an attractive golden color) render TiN a promising candidate for a variety of applications that includes coatings on cutting tools, self-heating crucibles, high-temperature heterogeneous catalysts and coatings on jewelry products. [4][5][6][7][8] Moreover, electronically conductive ceramics, such as porous TiN ceramics in particular, are of interest in other important potential applications. For example, porous TiN ceramics can be used as electrode materials in battery applications and as superconducting materials.…”

Section: Introductionmentioning

confidence: 99%

Electronically conductive porous TiN ceramics with enhanced strength by aqueous gel‐casting

et al. 2018

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In this paper, we report on a study of electronically conductive porous TiN ceramics prepared by aqueous gel‐casting. The effects of solid loading, sintering temperature, and sintering aids on the phase composition, microstructure, and volume fraction of porosity of the prepared porous TiN ceramics are studied. The SEM results show that porosity is uniformly distributed in all of the samples studied. With increasing solid loading and sintering temperature, the volume fraction of porosity decreases slowly. Moreover, the relationship between volume fraction of porosity and mechanical and electrical properties has also been investigated. Our results show that adding Y2O3‐TiO2 as combined sintering aids results in a sharp decrease in the volume fraction of porosity, and the volume fraction range changes from 42%‐60% to 28%‐52%. Moreover, adding sintering aids results in an increase in flexural strength and electrical conductivity with a change in maximum value from 34.6 MPa and 2.3 × 104 S∙m−1 to 101.6 MPa and 5.1 × 104 S∙m−1, respectively.

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“…Titanium nitride has become an important coating material to protect steels from wear and corrosion. The established techniques to prepare this coating are DC magnetron sputtering (1,2), physical vapor deposition (PVD) (3,4), and ion plating (5).…”

mentioning

confidence: 99%

Metallic Biomaterials TiN‐Coated: Corrosion Analysis and Biocompatibility

et al. 2003

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Corrosion processes due to contact with the physiological environment should be avoided or minimized in orthopedic implants. Four metallic substrates frequently used as biomaterials: pure Ti, Ti-6Al-4V alloy, ASTM F138 stainless steel, and Co-Cr-Mo alloy, were coated with TiN using the physical vapor deposition (PVD) technique. These coatings have been screened by polarization curves in physiological solutions. TiN prepared by PVD is efficient as coating for stainless steel. On titanium and alloy there are no benefits concerning the corrosion resistance compared to the bare Ti-materials. TiN coatings have been screened according to ISO 10993 standard tests for biocompatibility and exhibited no cytotoxicity, dermal irritation, or acute systemic toxicity response.

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Background of the titanium nitride deposition

Cited by 8 publications

References 3 publications

Study on the influence of nitrogen on titanium nitride in a dc post magnetron sputtering plasma system

Study on the influence of nitrogen on titanium nitride in a dc post magnetron sputtering plasma system

Electronically conductive porous TiN ceramics with enhanced strength by aqueous gel‐casting

Metallic Biomaterials TiN‐Coated: Corrosion Analysis and Biocompatibility

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