2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) 2015
DOI: 10.1109/eptc.2015.7412381
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Bond tool life improvement for large copper wire bonding

Tao Xu
1
,
Todd Walker
2
,
Raymond Chen
3
et al.
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Cited by 4 publications
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Quantification of the Energy Flows During Ultrasonic Wire Bonding Under Different Process Parameters

Long
1
,
Schneider
2
,
Li
3
et al. 2019
Int. J. of Precis. Eng. and Manuf.-Green Tech.
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Quantification of the Energy Flows During Ultrasonic Wire Bonding Under Different Process Parameters

Long
1
,
Schneider
2
,
Li
3
et al. 2019
Int. J. of Precis. Eng. and Manuf.-Green Tech.
6
0
3
0
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Impact of surface texture on ultrasonic wire bonding process

Long
1
,
Arndt2,
Dencker3
et al. 2022
Journal of Materials Research and Technology
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0
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Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process

Eacock
1
,
Unger
2
,
Eichwald
3
et al. 2016
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
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