Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature

Tyler, Daniel; Lukich, Svetlana; DePersia, Raul; Guilbeau, Chase; Carter, Mark

doi:10.4071/2380-4491.2021.hitec.000031

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)

2021

DOI: 10.4071/2380-4491.2021.hitec.000031

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Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature

Daniel Tyler¹,

Svetlana Lukich²,

Raul DePersia³

et al.

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Bridging the Gap: A Qualitative Study on the Viability and Performance of Metalized Polyetherimide (PEI) Film Capacitors at High Temperature

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