Broadband Dielectric Characterization from 10 mHz to 100 GHz of a 3D Printable Material

An intrinsic flame-retardant moiety, 9,10-dihydro-9oxa-10-phosphaphenanthrene-10-oxide (DOPO), is incorporated into oligo(2,6-dimethyl-1,4-phenylene ether) (OPE), and four phosphorus-containing telechelic OPE resins are synthesized. The first is synthesized with a para phenyl methacrylate end group (OPE-PM); the second is synthesized with para and meta phenyl methacrylate end groups (OPE-OPM); the third is synthesized with a para vinyl benzyl ether end group (OPE-VBE); and the fourth is synthesized with para and meta vinyl benzyl ether end groups (OPE-OVBE). All the self-cured samples showed good flexibility, high temperature (T g = 216 to 250 °C, T d5% > 400 °C), and water resistance (0.25%). The self-cured OPE-OPM and OPE-OVBE show outstanding low dielectric values of 2.63 and 2.65 and impressive low dissipation factors of 0.0035−0.0047 at 10 GHz, respectively. The results indicate that a further crosslinking behavior in the chain end can enhance the rigidity and further enhance the dielectric properties. Most importantly, all phosphinated thermosets show excellent burning resistance, and both UL-94 VTM and microscale combustion calorimetry experiments were conducted to explain the flame-retardant behavior. We believe that this work will contribute greatly to the research related to polymeric substrate materials for 5G technology.

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Synthesis of High-Tg, Flame-Retardant, and Low-Dissipation Telechelic Oligo(2,6-dimethylphenylene ether) Resins for High-Frequency Communications

Reddy

Chen

Lin

et al. 2022

ACS Appl. Polym. Mater.

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Tailored compliant mechanisms for reconfigurable electromagnetic devices

2023

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Reconfigurable electromagnetic devices, specifically reconfigurable antennas, have shown to be integral to the future of communication systems. However, mechanically robust designs that can survive real-world, harsh environment applications and high-power conditions remain rare to this day. In this paper, the general framework for a field of both discrete and continuously mechanically reconfigurable devices is established by combining compliant mechanisms with electromagnetics. To exemplify this new concept, a reconfigurable compliant mechanism antenna is demonstrated which exhibits continuously tunable performance across a broad band of frequencies. Moreover, three additional examples are also introduced that further showcase the versatility and advanced capabilities of compliant mechanism enabled electromagnetic devices. Unlike previous approaches, this is achieved with minimal part counts, additive manufacturing techniques, and high reliability, which mechanical compliant mechanism devices are known for. The results presented exemplify how compliant mechanisms have the capacity to transform the broader field of reconfigurable electromagnetic devices.

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Broadband Dielectric Characterization from 10 mHz to 100 GHz of a 3D Printable Material

Cited by 2 publications

References 59 publications

Synthesis of High-Tg, Flame-Retardant, and Low-Dissipation Telechelic Oligo(2,6-dimethylphenylene ether) Resins for High-Frequency Communications

Synthesis of High-Tg, Flame-Retardant, and Low-Dissipation Telechelic Oligo(2,6-dimethylphenylene ether) Resins for High-Frequency Communications

Tailored compliant mechanisms for reconfigurable electromagnetic devices

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