2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems 2014
DOI: 10.1109/epeps.2014.7103596
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Broadband integration using FR-4 to silicon CPW-to-CPW transition

Supreetha Rao Aroor
1
,
Richard G. Pierce
2
,
A.J. Blanchard
3
et al.
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Cited by 2 publications
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A Broadband Microstrip-to-Microstrip Transition for Flip-Chip Interconnects

Qiu
1
,
Deng
2
2021
2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-A
1
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A Broadband Microstrip-to-Microstrip Transition for Flip-Chip Interconnects

Qiu
1
,
Deng
2
2021
2021 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-A
1
0
0
0
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Design of Microstrip-to-Microstrip Transition for High-Density Flip-Chip Interconnects

Yan
1
,
Wu
2
,
Deng
3
2022
2022 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-A
0
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