Broadband low‐profile wire‐patch antenna

Low‐profile GSM‐DCS‐PCS‐UMTS wire patch antenna on small ground plane

“…Measured gain in GSM band is given in Figure 5. The maximum gain value is close to the one of a monopolar wire on finite ground plane that also shows the efficiency of the structure [4]. Figures 6(a) and 6(b) show the radiation patterns, measured at 1800 MHz also in the planes ⌽ ϭ 0°(XXЈ plane) and 90°(YYЈ plane).…”

“…However, dual band and obviously multiband operations still remain difficult using only two stacked wire-patches because the resonant frequencies then obtained are used to enlarge a single and desired bandwidth. When compared with these structures [3][4][5][6], the solution presented in this article has moreover the advantages to have a volume 1.15 time less and overall, the capability to operate in GSM but also in DCS, PCS, and UMTS standards. Figure 1 presents the geometry of the studied antenna.…”

“…Fortunately, it has been shown that microstrip antennas can be used below their classical fundamental modes by including ground wires connecting the radiating patches to the ground plane [1,2]. Concurrently, stacked elements are also a well-known solution to enlarge the bandwidth of microstrip structures [3][4][5]. Combining these two properties, a wide-band miniature circular GSM wire patch antenna on a small ground plane was presented in [6].…”

“…This printed coupling-feed technique requires no increase in the antenna volume and introduces no additional ohmic loss, which are advantageous over the traditional bandwidth-enhancement techniques of adding additional resonators to the antenna's radiating portion [3][4][5][6] or adding an external matching network on the system circuit board of the mobile phone [7][8][9][10]. However, it is noted that the coupling-feed design studied in [1,2] is required to be printed on two sides of a dielectric substrate, which makes the substrate thickness and permittivity strongly controlling the contributed capacitance of the coupling feed to the input impedance of the PIFA.…”

“…However, these dielectric substrate layers must be taken into account during the optimization phase and have to be as thin as possible to keep a large frequency bandwidth. As in [4,6], the lower plate is center fed by a coaxial probe, which also connects the upper one. This last one is made up of a square patch imbricated in a square ring, separated by two U slots and linked by two small metallic strips "s" (width ϭ 1 mm).…”