Buckling of a stiff thin film on a compliant substrate in large deformation

Song, Jizhou; Jiang, Hanqing; Liu, Z. J.; Khang, Dahl Young; Huang, Yonggang; Li, Jinghua; Lu, C.; Koh, C. G.

doi:10.1016/j.ijsolstr.2008.01.023

Cited by 252 publications

(217 citation statements)

References 35 publications

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“…Fractal-based structures bonded to pre-strained elastomers enable higher levels of elastic deformation 29,30 . A second order all-vertical Peano structure fully bonded onto an elastomeric substrate with 40% pre-strain demonstrates the concept.…”

Section: Resultsmentioning

confidence: 99%

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Fractal design concepts for stretchable electronics

et al. 2014

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Stretchable electronics provide a foundation for applications that exceed the scope of conventional wafer and circuit board technologies due to their unique capacity to integrate with soft materials and curvilinear surfaces. The range of possibilities is predicated on the development of device architectures that simultaneously offer advanced electronic function and compliant mechanics. Here we report that thin films of hard electronic materials patterned in deterministic fractal motifs and bonded to elastomers enable unusual mechanics with important implications in stretchable device design. In particular, we demonstrate the utility of Peano, Greek cross, Vicsek and other fractal constructs to yield space-filling structures of electronic materials, including monocrystalline silicon, for electrophysiological sensors, precision monitors and actuators, and radio frequency antennas. These devices support conformal mounting on the skin and have unique properties such as invisibility under magnetic resonance imaging. The results suggest that fractal-based layouts represent important strategies for hard-soft materials integration.

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Section: Resultsmentioning

confidence: 99%

“…resistive temperature sensing/heating element with an integrated electrode (recording, ground and reference components together) exploits this feature 30 (Fig. 4a).…”

Section: Article Nature Communications | Doi: 101038/ncomms4266mentioning

confidence: 99%

Fractal design concepts for stretchable electronics

et al. 2014

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“…Equations (1) and (2) agree very well with experimental observations when the pre-strain is small, but it was found out that larger pre-strain has significantly influenced the wavelength and amplitude. Song et al 15 obtained the wavelength and amplitude for finite deformation as…”

Section: Buckling Of Compressed Thin-film Structuresmentioning

confidence: 99%

Buckling analysis in stretchable electronics

et al. 2017

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In the last decade, stretchable electronics evolved as a class of novel systems that have electronic performances equal to established semiconductor technologies, but can be stretched, compressed, and twisted like a rubber band. The compliance and stretchability of these electronics allow them to conform and mount to soft, elastic biological organs and tissues, thereby providing attractive opportunities in health care and bio-sensing. Majority of stretchable electronic systems use an elastomeric substrate to carry an ultrathin circuit mesh that consists of sparsely distributed stiff, thin-film electronic components interconnected by various forms of stretchable metal strips or low-dimension materials. During the fabrication processes and application of stretchable electronics, the thin-film components or nanomaterials undergo different kinds of in-plane deformation that often leads to out-ofplane or lateral buckling, in-surface buckling, or a combination of all. A lot of creative concepts and ideas have been developed to control and harness buckling behaviors, commonly regarded as pervasive occurrences in structural designs, to facilitate fabrication of stretchable structures, or to enhance stretchability. This paper provides a brief review of recent progresses on buckling analysis in stretchable electronics. Detailed buckling mechanics reveals important correlations between the geometric/material properties and system performance (e.g., mechanical robustness, deformability, structural architecture, and control). These mechanics models and analysis provide insights to design and optimize stretchable electronics for a wide range of important applications.

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“…[1,2,3,4] and the recently published review paper by Rogers et al [5] and references therein. In order to provide conformability to the body and a high comfort during wearing, mechanical stretchability is a prerequisite for these electronics applications.…”

Section: Introductionmentioning

confidence: 99%

Stretching-induced interconnect delamination in stretchable electronic circuits

Sluis¹,

Hsu²,

Timmermans³

et al. 2010

J. Phys. D: Appl. Phys.

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Abstract. Stretchable electronics offer increased design freedom of electronic products. Typically, small rigid semiconductor islands are interconnected with thin metal conductor lines on top of, or encapsulated in, a highly compliant substrate, such as a rubber material. A key requirement is large stretchability, i.e. the ability to withstand large deformations during usage without any loss of functionality. Stretching induced delamination is one of the major failure modes that determines the amount of stretchability that can be achieved for a given interconnect design. During peel testing, performed to characterize the interface behaviour, the rubber is severely lifted at the delamination front while at the same time fibrillation of the rubber at the peel front is observed by ESEM analyses. The interface properties are established by combining the results of numerical simulations and peeling experiments at two distinct scales: the global force-displacement curves and local rubber lift geometries. The thus quantified parameters are used to predict the delamination behaviour of zigzag and horseshoe patterned interconnect structures. The accuracy of these finite element simulations is assessed by a comparison of the calculated evolution of the shape of the interconnect structures and the fibrillation areas during stretching with experimental results obtained by detailed in-situ analyses.

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Buckling of a stiff thin film on a compliant substrate in large deformation

Cited by 252 publications

References 35 publications

Fractal design concepts for stretchable electronics

Fractal design concepts for stretchable electronics

Buckling analysis in stretchable electronics

Stretching-induced interconnect delamination in stretchable electronic circuits

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