Abstract:As prevailing copper interconnect technology advances to its fundamental physical limit, interconnect delay due to ever-increasing wire resistivity has greatly limited the circuit miniaturization. Single-walled carbon nanotubes (SWCNTs) bundle interconnects have emerged as a promising replacement material for copper interconnects due to their superior conductivity. Previous works have focused on studying device and interconnect modeling for bundled SWCNTs while none of them consider deployment of such an advan… Show more
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