C-band oscillator using high-Q inductors embedded in multi-layer organic packaging

Abstract

We present C-band oscillators with external high4 inductors: wire-bond inductors and embedded inductors in a Mum-Layer Organic (MLO) board fabricated by a thick-film MCM-L technology. The phase-noise performance of oscillators are compared with the oscillator using onship inductors. Inductors are designed to obtain high quality factor In C-band. The phase-noise performauce ofthe oscillator with onsbip Inductors measures -108 dBc/Hz at 600 KHz offset frequency, and that of the oscillator with external inductors shows -113 dBcJHz at the same offset. Using MLO inductors, the phase-noise is better than the oscillator with onship inductors and comparable to the oscillator with wirebond inductors. To our knowledge, this is the first C-band oscillator using inductors embedded in the multi-layer organic packaging technology. This is. also the first report comparing the performance of oscillators using three different inductor technologies: onsbip Integration, wire-bonding, and multi-layer orgauic packaging technology.

A CMOS voltage-controlled oscillator using high-Q on-chip inductor implemented in a wafer-level package

“…Unlike on-chip solutions mentioned above, an inductor embedded in a package using a wire-line has also been considered as a good candidate for an off-chip solution. Embedded inductors are usually implemented in a multichip package [6][7][8]. However, recently, an inductor in a WLP has been published [9].…”