2019 IEEE 69th Electronic Components and Technology Conference (ECTC) 2019
DOI: 10.1109/ectc.2019.00245
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C4 Compatible Ultra-Thick Cu On-chip Magnetic Inductor Architecture Integrated with Advanced Polymer/Cu Planarization Process

Chien-Hung Kuo1,
Seung-Taek Yang2,
Chun-Chi Kuo3
et al.
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