CAMON: Low-Cost Silicon Photonic Chiplet for Manycore Processors

Wang, Zhehui; Xu, Jiang; Chang, Yi-Shing; Feng, Jun; Chen, Xuanqi; Chen, Shixi; Zhang, Jiaxu

doi:10.1109/tcad.2019.2926495

Cited by 15 publications

(2 citation statements)

References 49 publications

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“…The POPSTAR architecture has been designed to be robust and modular based on technological constraints, in a pragmatic approach toward implementation, leveraging various concepts introduced in previous works. Measured MRR models favor single waveguide paths to multi-hop architectures such as [5][11][13][20][23] [26]. The serpentine ring crossbar of [6] presented a similar decentralized approach.…”

Section: Discussionmentioning

confidence: 99%

POPSTAR: a Robust Modular Optical NoC Architecture for Chiplet-based 3D Integrated Systems

Thonnart

Bernabé

Charbonnier

et al. 2020

2020 Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition (DATE)

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Silicon photonics technology is now gaining maturity with increasing levels of design complexity from devices to large photonic integrated circuits. Close integration of control electronics with 3D assembly of photonics and CMOS opens the way to high-performance computing architectures partitioned in chiplets connected by optical NoC on silicon photonic interposers. In this paper, we give an overview of our works on optical links and NoC for manycore systems, from low-level control of photonic devices to high-level system optimization of the optical communications. We detail the POPSTAR optical NoC topology and architecture (Processors On Photonic Silicon interposer Terascale ARchitecture) with electro-optical interface chiplets, the corresponding nested spiral topology for single-writer multiplereader links and the associated control electronics, in charge of high-speed drivers, thermal stabilization and handling of the protocol stack, from data integrity to flow-control, routing and arbitration of the optical communications. The strengths and opportunities for this architecture will be discussed, with a shift in system & implementation constraints with respect to previous optical NoC proposals, and new challenges to be addressed.

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Section: Discussionmentioning

confidence: 99%

POPSTAR: a Robust Modular Optical NoC Architecture for Chiplet-based 3D Integrated Systems

Thonnart

Bernabé

Charbonnier

et al. 2020

2020 Design, Automation &Amp; Test in Europe Conference &Amp; Exhibition (DATE)

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“…Since the first proposal of Goodman et al [218] in 1984, optical interconnection networks have become promising to offer high-quality transmission in applications ranging from high-performance computing [219], memory access networks [220,221], data center networks [222], to even analog computing [223]. The continued progress makes this technology a natural solution to the fundamental conflicts between performance scaling and thermal constraints in future multiprocessor systems.…”

Section: Statusmentioning

confidence: 99%

Co-packaged optics (CPO): status, challenges, and solutions

Tan

Liu³

et al. 2023

Front. Optoelectron.

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Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three-fourths of the datacenter traffic resides within datacenters. The conventional pluggable optics increases at a much slower rate than that of datacenter traffic. The gap between application requirements and the capability of conventional pluggable optics keeps increasing, a trend that is unsustainable. Co-packaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy efficiency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics. CPO is widely regarded as a promising solution for future datacenter interconnections, and silicon platform is the most promising platform for large-scale integration. Leading international companies (e.g., Intel, Broadcom and IBM) have heavily investigated in CPO technology, an inter-disciplinary research field that involves photonic devices, integrated circuits design, packaging, photonic device modeling, electronic-photonic co-simulation, applications, and standardization. This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform, identify the key challenges, and point out the potential solutions, hoping to encourage collaboration between different research fields to accelerate the development of CPO technology. Graphical Abstract

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Silicon Photonics for Future Computing Systems

Shafiee

Pasricha

Nikdast

2022

Wiley Encyclopedia of Electrical and Electronics Engineering

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The primary goal of this article is to provide an overview of silicon photonics technology and its applications in the design and improvement of current and future computing systems. We start by reviewing silicon photonics technology and introducing some of its benefits and challenges as well as providing some background on it. Next, we introduce some fundamental silicon photonic components in the design of silicon photonic integrated circuits (PICs) and optical interconnect for computing systems as well as their operating principles and applications. These components can be active, such as photodetectors and optical modulators, or passive, such as silicon‐on‐insulator (SOI) waveguides. Subsequently, we discuss the application of silicon photonics to improve the communication and computation infrastructure in future computing systems, while reviewing the state‐of‐the‐art and some design and implementation challenges. Finally, we discuss several research opportunities to push forward the application of silicon photonics in the design of future computing systems.

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CAMON: Low-Cost Silicon Photonic Chiplet for Manycore Processors

Cited by 15 publications

References 49 publications

POPSTAR: a Robust Modular Optical NoC Architecture for Chiplet-based 3D Integrated Systems

POPSTAR: a Robust Modular Optical NoC Architecture for Chiplet-based 3D Integrated Systems

Co-packaged optics (CPO): status, challenges, and solutions

Silicon Photonics for Future Computing Systems

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