2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) 2023
DOI: 10.1109/eptc59621.2023.10457591
|View full text |Cite
|
Sign up to set email alerts
|

Capacitive-based Wire Bonding Defects Detection Method for Integrated Circuit Package in Strip Form with Hybrid Threshold Setting Algorithm

Tie Qiu,
Leslie Khoo,
Joseph Tan
et al.
Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Publication Types

Select...

Relationship

0
0

Authors

Journals

citations
Cited by 0 publications
references
References 6 publications
0
0
0
Order By: Relevance

No citations

Set email alert for when this publication receives citations?