Caracterização Do Resíduo Do Processo De Wafer Backside Grinding E Potencialidade De Utilização Como Coproduto

Dutra, William Todendi; Reis, Anderson da Silva Stumpf dos; Bobsin, Alexsandro; Fernandes, Iara Janaína; Pesenti, Giovani; Brehm, Feliciane Andrade; Moraes, Carlos Alberto Mendes

doi:10.5151/2594-5327-34893

ABM Proceedings 2022

DOI: 10.5151/2594-5327-34893

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Caracterização Do Resíduo Do Processo De Wafer Backside Grinding E Potencialidade De Utilização Como Coproduto

William Todendi Dutra¹,

Anderson da Silva Stumpf dos Reis²,

Alexsandro Bobsin³

et al.

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Caracterização Do Resíduo Do Processo De Wafer Backside Grinding E Potencialidade De Utilização Como Coproduto

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