Carbon-black thixotropic thermal pastes for improving thermal contacts

Leong, Chia-Ken; Aoyagi, Yasuhiro; Chung, D.D.L.

doi:10.1007/s11664-005-0259-2

Cited by 30 publications

(34 citation statements)

References 9 publications

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“…5 The pressure applied to the thermal contact in the direction perpendicular to the plane of the contact is another parameter that should be controlled. Thus, in relation to the third objective, this work compares TIMs that are tested using the same technique under identical conditions.…”

Section: à6mentioning

confidence: 99%

“…The comparison involves a large variety of TIMs, due to the extensive prior work of one of the authors (D.D.L.C.). [1][2][3][4][5][6][7]10,11,20,21 EXPERIMENTAL PROCEDURES…”

Section: à6mentioning

confidence: 99%

“…One of the most common and reliable methods for measurement of thermal contact conductance is the guarded hot plate method (ASTM method D5470), 5,11 which is a steady-state method. This method involves measurement of the thermal resistance at thermal equilibrium between a hot surface and a cold surface that sandwich a specimen.…”

Section: Measurement Of Thermal Contact Conductancementioning

confidence: 99%

“…This level of roughness is the same as that of prior work that referred to this as the ''rough'' case. 5,11 Each copper cylinder had height of 30.0 mm and diameter of 1.25 inches (31.7 mm). Each cylinder had two drilled blind holes (3.3 mm diameter) for inserting a thermocouple.…”

Section: Measurement Of Thermal Contact Conductancementioning

confidence: 99%

“…For the sake of conformability, the vehicle should be sufficiently fluid. Silver particles, 2,3 carbon black, [4][5][6] and graphite nanoplatelets 7,8 are effective particles for formulating thermal pastes. Due to the attraction of a paste that is electrically nonconductive, zinc oxide particles 9 and fumed alumina particles 10 are also used to formulate thermal pastes.…”

Section: Introductionmentioning

confidence: 99%

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Solder–Graphite Network Composite Sheets as High-Performance Thermal Interface Materials

Sharma

Chung

2015

Journal of Elec Materi

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Low-cost solder-graphite composite sheets ( ‡55 vol.% solder), with solder and graphite forming interpenetrating networks to a degree, are excellent thermal interface materials (TIMs). Solders 63Sn-37Pb and 95.5Sn-4Ag-0.5Cu are separately used, with the latter performing better. In composite fabrication, a mixture of micrometer-size solder powder and ozone-treated exfoliated graphite is compressed to form a graphite network, followed by fluxless solder reflow and subsequent hot pressing to form the solder network. The network connectivity (enhanced by ozone treatment) is lower in the through-thickness direction. The electrical conductivity obeys the rule of mixtures (parallel model in-plane and series model through-thickness), with anisotropy 7. Thermal contact conductance £26 9 10 4 W/(m 2 K) (with 15-lm-roughness copper sandwiching surfaces), through-thickness thermal conductivity £52 W/ (m K), and in-plane thermal expansion coefficient 1 9 10 À5 /°C are obtained. The contact conductance exceeds or is comparable to that of all other TIMs, provided that solder reflow has occurred and the composite thickness is £100 lm. Upon decreasing the thickness below 100 lm, the sandwich thermal resistivity decreases abruptly, the composite through-thickness thermal conductivity increases abruptly to values comparable to the calculated values based on the rule of mixtures (parallel model), and the composite-copper interfacial thermal resistivity (rather than the composite resistivity) becomes dominant.

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Section: à6mentioning

confidence: 99%

“…The comparison involves a large variety of TIMs, due to the extensive prior work of one of the authors (D.D.L.C.). [1][2][3][4][5][6][7]10,11,20,21 EXPERIMENTAL PROCEDURES…”

Section: à6mentioning

confidence: 99%

Section: Measurement Of Thermal Contact Conductancementioning

confidence: 99%

Section: Measurement Of Thermal Contact Conductancementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Solder–Graphite Network Composite Sheets as High-Performance Thermal Interface Materials

Sharma

Chung

2015

Journal of Elec Materi

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Effect of nanosized carbon black on the morphology, transport, and mechanical properties of rubbery epoxy and silicone composites

Raza

Westwood

Stirling³

et al. 2012

J of Applied Polymer Sci

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Three different types of nanosized carbon black (CB), Printex XE2 (CBP), Vulcan XC72, and Printex 140 U (CBU), were dispersed by mechanical mixing in rubbery epoxy (RE) and silicone to produce composites. It was found that the maximum possible loading of CB in the polymers depended on the surface area of CB. For a given loading, all three CBs produced similar improvements in the thermal conductivity of the resulting composites, but their effects on the electrical conductivity varied and ranged from insulating composites with CBU to conducting composites with CBP. CBP produced a greater improvement in the electrical conductivity than the thermal conductivity of the polymers compared to the other CBs. This was attributed to the high structure of CBP, which led to the formation of a concatenated structure within the matrix. The CB/silicone composites had a similar thermal conductivity to that of the CB/RE composites, but only the CBP/silicone composite produced at 8 wt % loading was electrically conducting. The compression and hardness properties of RE were also significantly improved with the addition of CB. However, in the case of silicone, only CBP had a considerable effect on the compression properties. © 2012 Wiley Periodicals, Inc. J Appl Polym Sci, 2012

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Performance of Thermal Interface Materials

Chung

2022

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The thermal interface materials (TIMs) used for improving thermal contacts are considered in terms of the performance, performance consideration criteria, performance evaluation methods, and material development approaches. The performance is described mainly by the thermal contact conductance, which refers to the conductance across the thermal contact surfaces that sandwiches the TIM. This conductance depends on the conformability, thermal conductivity, and small‐thickness feasibility. However, the vast majority of published work does not consider this conductance, but only the thermal conductivity within the TIM. The highest TIM performance is exhibited by the thermal pastes and low‐melting alloys.

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Carbon-black thixotropic thermal pastes for improving thermal contacts

Cited by 30 publications

References 9 publications

Solder–Graphite Network Composite Sheets as High-Performance Thermal Interface Materials

Solder–Graphite Network Composite Sheets as High-Performance Thermal Interface Materials

Effect of nanosized carbon black on the morphology, transport, and mechanical properties of rubbery epoxy and silicone composites

Performance of Thermal Interface Materials

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