Challenges and opportunities in engineering next-generation 3D microelectronic devices: improved performance and higher integration density

Singh, Niharika; Srivastava, Kingshuk; Kumar, Ajay; Yadav, Neha; Yadav, Ashish; Dubey, Santosh; Singh, Rajesh; Gehlot, Anita; Verma, Ajay Singh; Gupta, Neha; Kumar, Tanuj; Wu, Yongling; Hongyu, Zheng; Mondal, Aniruddha; Pandey, Kailash; Brajpuriya, Ranjeet; Kumar, Shalendra; Gupta, Rajeev

doi:10.1039/d4na00578c

Nanoscale Adv.

2024

DOI: 10.1039/d4na00578c

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Challenges and opportunities in engineering next-generation 3D microelectronic devices: improved performance and higher integration density

Niharika Singh,

Kingshuk Srivastava,

Ajay Kumar

et al.

Abstract: In recent years, nanotechnology and material science have evolved and matured, making it easier and easier to design and fabricate next-generation 3D microelectronics. The process has changed drastically from traditional...

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Application of Semiconductor Technology for Piezoelectric Energy Harvester Fabrication

Kubiak,

Bokla,

Klymkovych

et al. 2024

Energies

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In this paper, we propose the application of semiconductor technology processes to fabricate integrated silicon devices that demonstrate the piezoelectric energy harvesting effect. The harvesting structure converts thermal energy into electricity using a piezoelectric transducer, which generates electrical signals owing to the dynamic bending under pressure caused by the explosive boiling of the working fluid within the harvester. The challenges of previous works that included complex manufacturing processing and form limitations were addressed by the use of semiconductor technology based on laser beam processing, which led to simplification of the device’s fabrication. The electrical characterization of the fabricated harvester prototype proved its functionality in energy conversion and potential for integration with a step-up converter or power management integrated circuit (PMIC) generating stable impulses ranging from 0.4 to 1.5 V at a frequency of 7 Hz.

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Application of Semiconductor Technology for Piezoelectric Energy Harvester Fabrication

Kubiak,

Bokla,

Klymkovych

et al. 2024

Energies

View full text Add to dashboard Cite

show abstract

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Challenges and opportunities in engineering next-generation 3D microelectronic devices: improved performance and higher integration density

Abstract: In recent years, nanotechnology and material science have evolved and matured, making it easier and easier to design and fabricate next-generation 3D microelectronics. The process has changed drastically from traditional...

Cited by 1 publication

References 180 publications

Application of Semiconductor Technology for Piezoelectric Energy Harvester Fabrication

Application of Semiconductor Technology for Piezoelectric Energy Harvester Fabrication

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