Chemistry and properties of imide oligomers end-capped with phenylethynylphthalic anhydrides

Hergenrother, P. M.; Smith, Joseph G.

doi:10.1016/0032-3861(94)90744-7

Cited by 160 publications

(127 citation statements)

References 4 publications

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“…[6][7][8][9][10][11][12][13][14][15] It is of importance to design the cross-linkable moiety that crosslinking reaction should occur without the evolution of small volatile compounds to form the clear film and coating. Cross-linkable moieties that meet the required condition are phenylethynyl, cyanate, benzocyclobutane and so on.…”

mentioning

confidence: 99%

Synthesis of Thermally Cross-Linkable Fluorine-containing Poly(aryl ether ketone)s I. Phenylethynyl Terminated Poly(aryl ether ketone)s

Kimura

Nishichi

Yamashita

2002

Polym J

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ABSTRACT:Fluorine-containing poly(aryl ether ketone)s (PEKs) derived from 2,3,4,5,6-pentafluorobenzoic acid (PFBA) exhibit outstanding solubility, thermal stability, low dielectric constant, low moisture absorption and high transparency. Hence, they are expected to be available for optical and electric materials. In such applications, excellent solubility is of great advantage for making thin film and coating. Contrary to this advantage, this is of disadvantage from a point of solvent resistance. Thermally cross-linkable fluorine-containing PEKs terminated with phenylethynyl moiety (PEK-PEP) are synthesized to improve the solvent resistance in this study. Cross-linking reaction occurs over 320• Cand it brings about not only the outstanding solvent resistance but also the increase of T g . Relationship between the cross-linking density and T g can be fundamentally interpreted by configurational entropy theory. Furthermore, the cured PEK-PEPs possess excellent thermal stability with the 10% weight loss temperature in the range from 544 to 598• C.

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mentioning

confidence: 99%

Synthesis of Thermally Cross-Linkable Fluorine-containing Poly(aryl ether ketone)s I. Phenylethynyl Terminated Poly(aryl ether ketone)s

Kimura

Nishichi

Yamashita

2002

Polym J

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“…The extent of imidization can be determined from the heights of the absorption bands for imides I and III, terminated imide oligomers for high-temperature aerospace and aircraft applications, known as phenylethynyl-terminated imide (LaRC PETI), were developed at the National Aeronautics and Space Administration (NASA) Langley Research Center, USA [13][14][15][16][17][18][19]. These materials have broader processing windows and thermal oxidative stability than simple ethynyl-terminated materials, and consequently have many practical advantages as a potential material for coatings, adhesives, films, and composite matrix resins [20,21].…”

Section: Phenylethynyl-terminated Imide Polymermentioning

confidence: 99%

Phenylethynyl-terminated polyimide, exfoliated graphite nanoplatelets, and the composites: an overview

Cho

Drzal²

2016

Carbon letters

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In efforts to characterize and understand the properties and processing of phenylethynylterminated imide (LaRC PETI-5, simply referred to as PETI-5) oligomers and polymers as a high-temperature sizing material for carbon fiber-reinforced polymer matrix composites, PETI-5 imidization and thermal curing behaviors have been extensively investigated based on the phenylethynyl end-group reaction. These studies are reviewed here. In addition, the use of PETI-5 to enhance interfacial adhesion between carbon fibers and a bismaleimide (BMI) matrix, as well as the dynamic mechanical properties of carbon/BMI composites, are discussed. Reports on the thermal expansion behavior of intercalated graphite flake, and the effects of exfoliated graphite nanoplatelets (xGnP) on the properties of PETI-5 matrix composites are also reviewed. The dynamic mechanical and thermal properties and the electrical resistivity of xGnP/PETI-5 composites are characterized. The effect of liquid rubber amine-terminated poly(butadiene-co-acrylonitrile) (ATBN)-coated xGnP particles incorporated into epoxy resin on the toughness of xGnP/epoxy composites is examined in terms of its impact on Izod strength. This paper provides an extensive overview from fundamental studies on PETI-5 and xGnP, as well as applied studies on relevant composite materials.Key words: polyimide, exfoliated graphite nanoplatelets, carbon fiber, composite, properties Phenylethynyl-Terminated Imide PolymerPolyimides have been extensively used in the electronics industry [1] as coatings, films, or adhesives and also in composite applications [2] as a primary or secondary structural material. When incorporated with organic or inorganic fibers, including carbon fibers and glass fibers, they can potentially be applied as a sizing material for high-temperature uses. In advanced applications, one of the most desirable advantages of polyimides, especially the aromatic polyimides, is their excellent high-temperature performance. Their thermal characteristics, including high temperature stability and cure behavior, are critical to successful processing and to the final properties of the resulting polyimide. For aerospace and aircraft applications, advanced polymer materials must successfully maintain their properties at high service temperatures over a long exposure time [3][4][5].The important parameters influencing the heat resistance of a polymeric material are its glass transition temperature (T g ), melting point (T m ), thermal stability, and etc., which may depend on its thermal history. Accordingly, polymers that are used to fulfill such high temperature performance should exhibit a high T g or T m and have excellent thermal stability. Even though some polyimides meet the high temperature requirement, their uses have been limited due to processing difficulties, such as poor solubility in common solvents, the release of volatiles, brittleness, and high processing temperature [6,7].Aromatic polyimides, especially acetylene or ethynyl-terminated polyimides, have been extensiv...

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“…We examined to imprint processable thermosetting-resin by a metal mold and crosslinking it afterward. Phenylethynyl-terminated imide oligomer [12][13][14][15][16] was selected as such a resin. It has been examined to fabricate carbon fiber-reinforved plastic from various phenylethynyl-terminated imide origomers [17].…”

Section: Preparation and Properties Of Phenylethynyl-terminated Imidementioning

confidence: 99%

Preparation of Nanopatterned Polyimide by Imprinting and Curing Phenylethynyl- terminated Imide Oligomer

Ogino

Ōhashi

Yoshida

et al. 2014

J. Photopol. Sci. Technol.

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Addition-type phenylethynyl-terminated imide oligomers were synthesized from 4,4'-diaminodiphenyl ether(ODA), 4-phenylethynylphthalic anhydride (PEPA) and 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) or 4,4'-hexafluoroisopropylidene)-dianhydrid (6FDA), and preparation of nanopatterned polyimide was examined by imprinting the melted phenylethynyl-terminated imide oligomer and crosslinking the ethynyl groups. Crosslinked polyimide films were prepared by pressing the melted phenylethynyl-terminated imide oligomers and curing them under pressure at 370 ℃ afterward, and the properties of the polyimide films were studied for comparison. The crosslnked polyimide films had high glass transition temperature (Tg) above 320 ℃, and showed excellent tensile strength more than 100 MPa. Nanopatterned polyimide was prepared by imprinting the melted imide oligomer with a metal mold and curing it under pressure at 370 ℃ afterward. ZEONOR Ⓡ film could be imprinted using the imprinted and cured imide oligomer as sub-mold instead of the metal mold.

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Chemistry and properties of imide oligomers end-capped with phenylethynylphthalic anhydrides

Cited by 160 publications

References 4 publications

Synthesis of Thermally Cross-Linkable Fluorine-containing Poly(aryl ether ketone)s I. Phenylethynyl Terminated Poly(aryl ether ketone)s

Synthesis of Thermally Cross-Linkable Fluorine-containing Poly(aryl ether ketone)s I. Phenylethynyl Terminated Poly(aryl ether ketone)s

Phenylethynyl-terminated polyimide, exfoliated graphite nanoplatelets, and the composites: an overview

Preparation of Nanopatterned Polyimide by Imprinting and Curing Phenylethynyl- terminated Imide Oligomer

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