Chip-scale-packaging applied to optical transceivers

Digital avionics technology options to consider for fiber optics communication on future generation aerospace platforms encompass transmitters and receivers operating at 25 Gb/sec and higher data rates. A new round of device and packaging innovation and development will likely ensue as a stepping-stone based on prior work in the areas of single wavelength transmitter, receiver / transceiver and multi-wavelength optical subassembly development.

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Toward future generation digital avionics fiber optic communication

Bassinan

Ahadian

Beranek

et al. 2023

Next-Generation Optical Communication: Components, Sub-Systems, and Systems XII

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Chip-scale-packaging applied to optical transceivers

Cited by 1 publication

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Toward future generation digital avionics fiber optic communication

Toward future generation digital avionics fiber optic communication

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