2004
DOI: 10.1109/tbme.2004.826680
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Chronic Neural Recording Using Silicon-Substrate Microelectrode Arrays Implanted in Cerebral Cortex

Abstract: An important aspect of the development of cortical prostheses is the enhancement of suitable implantable microelectrode arrays for chronic neural recording. The objective of this study was to investigate the recording performance of silicon-substrate micromachined probes in terms of reliability and signal quality. These probes were found to consistently and reliably provide high-quality spike recordings over extended periods of time lasting up to 127 days. In a consecutive series of ten rodents involving 14 im… Show more

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Cited by 424 publications
(374 citation statements)
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“…Twenty-one male Sprague-Dawley rats were implanted with 26 16-channel chronic silicon "Michigan" microelectrode arrays, using experimental procedures outlined previously (Ludwig et al 2006;Vetter et al 2004). Arrays consisted of four shanks, each with four evenly spaced iridium electrodes.…”
Section: Microelectrodesmentioning
confidence: 99%
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“…Twenty-one male Sprague-Dawley rats were implanted with 26 16-channel chronic silicon "Michigan" microelectrode arrays, using experimental procedures outlined previously (Ludwig et al 2006;Vetter et al 2004). Arrays consisted of four shanks, each with four evenly spaced iridium electrodes.…”
Section: Microelectrodesmentioning
confidence: 99%
“…Typically either an additional microelectrode, or a large electrode such as a stainless-steel bone screw, or stripped wire, is placed in a location with minimal cortical activity and used as a reference to subtract out correlated sources of noise (Blanche et al 2005;Henze et al 2000;Ludwig et al 2006;Nelson et al 2008;Vetter et al 2004;Webster 1998;Williams et al 1999). Both microelectrode and large electrode references have their own specific advantages and disadvantages.…”
Section: Introductionmentioning
confidence: 99%
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“…16 Silicon arrays may be configured as shanks, each with a number of recording sites along each shank. 17 To produce such an array, guided boron diffusion into a silicon wafer is performed to define the shape and thickness of the device. After this step, layers of insulating material, conductive interconnects, and additional surface insulation are applied.…”
Section: Signal Detectionmentioning
confidence: 99%