Circuit engineering solutions for high - temperature analog microcircuits in extreme environmental conditions

Abstract

The current geopolitical situation and import–substitution challenges facing the domestic electronics industry require the creation of devices capable of reliably functioning in extreme environmental conditions, at particularly high temperatures. When developing electronic devices that must function reliably in temperature range beyond the usual values, developers should rely on cooling, active or passive. There may be situations when cooling is impractical or impossible. The operation of the device in special temperature range, in some situations, makes perfect sense if it provides reduction in the cost of the device or increase in its reliability. In such situations, it is necessary to solve many complex problems, including semiconductor manufacturing technology, design and testing methods. The article examines the issues of creating high–temperature electronics components necessary for the long-term development of the domestic oil–and–gas and aerospace industries. Creation of import-substituting technologies for intelligent wells makes it possible to reduce significantly the cost of equipment. In aerospace industry, this problem is even more actual: the cost of “western” computing devices for use in space reaches half million euros, and under the conditions of sanctions, its purchase may not be available, while similar import-substituting domestic device is up to 10 times cheaper. Flights to near and far space require, in addition to high radiation resistance, the reliability of all spacecraft systems in the wide temperature range. Article presents technical characteristics of the main analog chips designed to operate at temperatures up to +125 ° C.

Basic functional units of high-temperature analog-to-digital sensor interfaces

“…Secondly, these are basic functional units (BFUs) of the second (increased) complexity (analog-to-digital converters, processors, multiplexers, spectrum limiters, etc. [1]). Analysis of the information on high-temperature SiGe and SOI electronics [2][3][4][5][6][7][8][9][10] shows that the high-temperature products developed by the world's leading microelectronics companies belong to the class of first-level complexity IP-modules of the first level of complexity.…”