2006
DOI: 10.1016/j.progsolidstchem.2005.11.046
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(Co)polyimides from commonly used monomers, and their nanocomposites

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Cited by 31 publications
(19 citation statements)
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“…As a last measure to improve the strength, co-polyimide film was synthesized in this work by choosing PPDA and ODA as co-diamine source. It is reported by Huang et al [5] that the film of SBPDA-PPDA/ODA had a 35% higher ultimate strength and a 64% higher elongation at break at the ambient temperature than the reference polyimide (SPBDA-PPDA), and also retained the strength and exhibited a 200% higher elongation at a temperature of 200 • C. Fig. 4 shows the FTIR spectra of the films after treatment at 100 • C and 350 • C respectively.…”
Section: Synthesis and Characterization Of Co-polyimidesmentioning
confidence: 91%
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“…As a last measure to improve the strength, co-polyimide film was synthesized in this work by choosing PPDA and ODA as co-diamine source. It is reported by Huang et al [5] that the film of SBPDA-PPDA/ODA had a 35% higher ultimate strength and a 64% higher elongation at break at the ambient temperature than the reference polyimide (SPBDA-PPDA), and also retained the strength and exhibited a 200% higher elongation at a temperature of 200 • C. Fig. 4 shows the FTIR spectra of the films after treatment at 100 • C and 350 • C respectively.…”
Section: Synthesis and Characterization Of Co-polyimidesmentioning
confidence: 91%
“…The molar ratio of SPBDA, PPDA, and ODA was 1:0.75:0.25 respectively and total solid content of monomers was calculated to be 18 wt%. Polymerization reaction was carried out in nitrogen environment at a temperature of 10 • C with vigorous stirring for 48 h to obtain a polyamic acid solution [5].…”
Section: Synthesis Of Polyamic Acid Of Sbpda-ppda/odamentioning
confidence: 99%
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“…Aromatic polyimide (PI) fibers have been recognized as one of the important members in the family of high-performance polymeric fibers that can be widely used in high performance composites since the PI possesses remarkably valuable properties, such as excellent mechanical and dielectric properties, outstanding thermal stability, and good chemical and irradiation resistances [1][2][3][4].…”
Section: Introductionmentioning
confidence: 99%
“…[7][8][9][10][11][12] Due to its high modulus and strength, excellent thermal stability, and dielectric properties, polyimide (PI) has been considered to be a high performance engineering material and used as adhesives, dielectrics, and membrane materials. [13][14][15][16][17] The electrospun PI nanofibers have been investigated in terms of their microstructure and intrinsic properties. In order to improve its mechanical properties, PI has also been electrospun with inorganic fillers to prepare nanofiber composites.…”
mentioning
confidence: 99%