2021
DOI: 10.1016/j.compositesb.2021.109349
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Cold sintered composites consisting of PEEK and metal oxides with improved electrical properties via the hybrid interfaces

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Cited by 15 publications
(7 citation statements)
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“…28 Due to the ultralow sintering temperature, CSP is feasible to fabricate multi-material systems, such as ceramic-polymer, ceramic-2D material, and ceramicmetal composites. [29][30][31][32][33][34][35][36] Moreover, the low sintering temperature and short holding time can effectively inhibit the exaggerated grain growth, indicating that CSP has great application potential in the preparation of nanome-ter or submicron functional ceramics. At present, CSP has successfully applied in microwave dielectric, ferroelectric, piezoelectric, target material, lithium battery, thermoelectric, and optical material.…”
Section: Introductionmentioning
confidence: 99%
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“…28 Due to the ultralow sintering temperature, CSP is feasible to fabricate multi-material systems, such as ceramic-polymer, ceramic-2D material, and ceramicmetal composites. [29][30][31][32][33][34][35][36] Moreover, the low sintering temperature and short holding time can effectively inhibit the exaggerated grain growth, indicating that CSP has great application potential in the preparation of nanome-ter or submicron functional ceramics. At present, CSP has successfully applied in microwave dielectric, ferroelectric, piezoelectric, target material, lithium battery, thermoelectric, and optical material.…”
Section: Introductionmentioning
confidence: 99%
“…Compared with other sintering methods, it dramatically reduces the energy consumption, which is only 1/10–1/100 of that for TTS process 28 . Due to the ultralow sintering temperature, CSP is feasible to fabricate multi‐material systems, such as ceramic–polymer, ceramic‐2D material, and ceramic–metal composites 29–36 . Moreover, the low sintering temperature and short holding time can effectively inhibit the exaggerated grain growth, indicating that CSP has great application potential in the preparation of nanometer or submicron functional ceramics.…”
Section: Introductionmentioning
confidence: 99%
“…Grain boundaries act as interfaces separating two homogeneous crystalline phases within polycrystalline systems such as ceramics, metals, or organic crystals [ 1 , 2 , 3 ]. The chemical properties and physical structures of the grain boundaries have significant impacts on the performances of both structural and functional materials [ 4 , 5 ]. Consequently, the manipulation of grain boundary structures was widely used to design new ceramic materials or improve their electrical and mechanical properties [ 6 , 7 ].…”
Section: Introductionmentioning
confidence: 99%
“…Zhao et al [41] reported that ZnO-PTFE (polytetrafluoroethylene) composites could be designed based on CSP and densified at a low temperature of 285 • C. Furthermore, PTFE was also used to modulate the microstructure and electrical properties of other ceramics such as SiO 2 [42] and BaTiO 3 [43], based on CSP. Recently, Si et al successfully integrated the thermoplastic polymer of poly-ether-ether-ketone (PEEK) with some nanoscale metal oxides into ZnO ceramic using CSP [5]. The ZnO-PEEK-oxide composite presents a switch-like effect which refers to high resistance state under a low electric field, and low resistance state under a high electric field.…”
Section: Introductionmentioning
confidence: 99%
“…With the assist of capillary force together with external force (MPa), the particles diffuse to locations with a lower chemical potential, and dense ceramics are formed with the removal of porosity. The mild sintering condition provides an opportunity for the cosintering of ceramics with other materials, such as polymers [24][25][26], and 2D materials [27]. It is anticipated that ceramics can be co-sintered with C60 using cold sintering process.…”
Section: Introductionmentioning
confidence: 99%