Comparative study on the wettability and thermal aging characteristics of SAC 305 nanocomposite solder fabricated by stir-casting and ultrasonic treatment

Rajendran, Sri Harini; Cho, Do Hoon; Jung, Jae Pil

doi:10.1016/j.mtcomm.2022.103814

Cited by 7 publications

(2 citation statements)

References 61 publications

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“…Lead-free solder joints are widely used in the electronic packaging industry because of their environmental friendliness, and the popular Sn-Ag-Cu (SAC) system solder alloy is the alternative with the greatest potential for Sn-Pb solder replacement owing to its good wettability and comprehensive performance (Zhong et al , 2016; Gan et al , 2019; Gan et al , 2021b; Rajendran et al , 2022; Li et al , 2022; Liu et al , 2022). However, investigations have found that, as the Ag content decreases, SAC solders also have some disadvantages, such as a high melting temperature, thick intermetallic compounds (IMCs) and insufficient oxidation resistance characteristics, which can lead to poor reliabilities of solder joints (Ma et al , 2019; Jing et al , 2017).…”

Section: Introductionmentioning

confidence: 99%

Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature

Gan

Chen

Jiang

et al. 2022

SSMT

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Purpose This study aims to evaluate the effect of thermal aging temperature on the properties of Cu/Al joints. Design/methodology/approach A new method in which 1 µm Zn-particles and SAC0307 with a particle size of 25–38 µm were mixed to fill the joint and successfully achieved the micro-joining of Cu/Al under ultrasonic-assisted at 200°C, and then, the effect of aging temperature on the properties of Cu/Al joints at different aging times was researched. Findings The results showed that the Cu interface intermetallic compounds (IMCs) had the same composition and had two layers with Cu5Zn8 near the Cu substrate and CuZn5 near the solder. As the aging time increased, CuZn5 gradually transformed to Cu5Zn8, and the thickness of the CuZn5 layer gradually decreased until CuZn5 disappeared completely. There was a Sn–Zn solid solution at the Al interface, and the composition of the Al interface of the Cu/Al joints did not change with changing temperature. The IMC thickness at the Cu interface of the joints continued to increase, and the shear strength of the Cu/Al joints decreased with increasing aging temperature and time. Compared with the as-received samples, the IMC thickness of the Cu interface of joints increased by 371.8% and the shear strength of the Cu/Al joints was reduced by 83.2% when the joints were aged at 150°C for 24 h. With an increase in aging temperature, the fracture mode of the Cu/Al joints changed from being between solder balls and Zn particles to between Zn particles. Originality/value With increasing aging temperature, the shear strengths of the Cu/SACZ/Al joints decreased at the same aging time, the shear strength of Cu/SACZ/Al joints at 150°C for 24h decreased by 83.2% compared with that of the as-received joints.

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Section: Introductionmentioning

confidence: 99%

Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature

Gan

Chen

Jiang

et al. 2022

SSMT

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“…However, these studies had little effect in improving the solder performance, solderability and the melting temperature (Jing et al, 2017;Ma et al, 2017; The current issue and full text archive of this journal is available on Emerald Insight at: https://www.emerald.com/insight/0954-0911.htm Zhao et al, 2016). Recently, several different methods were proposed to decrease soldering temperatures including using composite solder (mixed by high-and low-temperature solder) (Shen et al, 2019), nanosolders (Roshanghias et al, 2015), nanoparticle reinforced composite solder or solder paste (Rajendran et al, 2022;Min et al, 2019), nanoparticle reinforced solders or solder pastes and low-temperature stir soldering simultaneously (Gan et al, 2013a;Gan et al, 2013b;Gan et al, 2013c), nanoparticle reinforced solder or solder paste and ultrasonic soldering simultaneously (Gan et al, 2019;Gan et al, 2018;Gan et al, 2017) and so on. But all needed flux.…”

Section: Introductionmentioning

confidence: 99%

Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted

Gan

Chen

Jiang

et al. 2022

SSMT

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Purpose This study aims to research properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted. Design/methodology/approach A new method that 1µm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 µm were mixed to fill the joint and successfully achieved micro-joining of Cu/Cu under ultrasonic-assisted at low temperature. Findings The results showed that with a continuous increase in the Zn-particle content, the interfacial intermetallic compounds (IMCs) of the upper and lower interfaces of joints gradually changed from scallop-shaped Cu6Sn5 to wavy-shaped Cu5Zn8. Moreover, the IMC thickness of the upper/lower interface of joints first decreased and then increased with increasing Zn-particle content. The shear strengths of joints increased with Zn-particle content, the shear strength of joints went to a maximum of 29.76 MPa when the Zn-particle content was 40%, an increase of 62.6% compared to joints without Zn particles. However, as the Zn-particle content continued to increase, the shear strengths of the joints decreased. Additionally, when the Zn content increased to 50%, because the oxidation degree of Zn particles increased, the joints were mainly broken among Zn particles. Originality/value A new method that 1µm Zn particles and Sn-0.3Ag-0.7 (SAC0307) with a particle size of 25–38 µm were mixed to fill the Cu/Cu joint at 180°C.

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Effect of Surface-Treated Filler on the Wettability of Composite Solder: Short Review

Saufee,

Leong,

Mohammad

et al. 2023

Springer Proceedings in Physics

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Comparative study on the wettability and thermal aging characteristics of SAC 305 nanocomposite solder fabricated by stir-casting and ultrasonic treatment

Cited by 7 publications

References 61 publications

Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature

Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature

Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted

Effect of Surface-Treated Filler on the Wettability of Composite Solder: Short Review

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