2006 International Conference on Electronic Materials and Packaging 2006
DOI: 10.1109/emap.2006.4430567
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Comparison between Experimental Measurement and Numerical Analysis of Warpage in PBGA Package and Assembly with the Consideration of Residual Strain in the Molding Compound

Ming-Yi Tsai
1
,
Y.C. Chen
2
,
S. W. Ricky Lee
3
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