Comprehensive analysis of vacancy dynamics due to electromigration

Simulation of Texture Development Caused Stress Build-Up in Electroplated Copper Lines

“…electromigration behavior. The stress distribution acts as an Basically, residual stresses develop due to the microstructure additional material transport force and causes anisotropy in evolution during metal layer deposition processes and days self-diffusion and electromigration [1,10]. and months aftermath [8].…”