Comprehensive properties study of polyimide with fluorinated nanofillers

Abstract

There is an increasing demand for polyimide (PI) with excellent mechanical properties, good heat resistance, and low dielectric constant in integrated circuits and advanced packaging. Based on this, we report a strategy of tailoring the PI via fluorinated nanofillers modification to improve its mechanical properties, heat resistance, hydrophobicity, and reduce its dielectric constant. Specifically, different fluorinated nanofiller, including fluorinated graphene (FG), fluorinated carbon nanotubes (FCNT), fluorinated carbon black (FCB), and fluorinated graphene quantum dots (FGQD) were introduced into PI matrix to prepared composite films by a simple method of in‐situ polymerization, and the effect of different nanofillers on the properties of polyimide was systematically investigated. The results showed that the introduction of fluorinated nanofillers significantly improved the comprehensive performance of the composite films, especially the FGQD. FGQD/PI composite film with 0.5 wt% FGQD exhibits superior tensile strength (145.8 MPa), Young's modulus (2.83 GPa) and elongation at break (45.4%) the best comprehensive performance which are 10.0%, 19.4%, and 32.0% of those of pure PI, respectively. Most importantly, the FGQD/PI composite film shows decreased dielectric constant (from 3.38 to 2.93) at 1 MHz improved hydrophobicity and excellent heat resistance. The FGQD/PI composite film exhibits excellent comprehensive performance, thereby showing the potential in the future development of advanced packaging and microelectronics industry.

Versatile Landscape of Low-k Polyimide: Theories, Synthesis, Synergistic Properties, and Industrial Integration

“…Meanwhile, the ductility of this PI composite was also improved at room temperature. Zhang et al 155 introduced FGQD into PI for the first time. The dielectric constant of 0.5 wt % FCQD/PI composite film was reduced to 2.93 (f = 10 6 Hz).…”

“…It is an efficacious method to reduce the permittivity of PI by adding low- k fillers. The more commonly used fillers include fluorinated graphene, − modified graphene oxide, , fluorine resin, and clay (the most commonly used is montmorillonite) . Because of the differences in composition, properties, and structure between multiple phases, interfacial effects exist between the PI matrix and the inorganic/organic phases, which will affect the interfacial polarization of the PI composite system and thus have a direct impact on the dielectric properties .…”

Green synthesis of polyimide by using an ethanol solvothermal method for aqueous zinc batteries

“…As described above, the synthesis of polyimides (PIs) oen employs organic solvents such as m-cresol, 29 1-methyl-2pyrrolidone (NMP), [30][31][32] N,N-dimethylformamide (DMF), 33 N,Ndimethylacetamide (DMAc) 34,35 and isoquinoline. 36 The use of these organic solvents is environmentally unfriendly and does not align with the objectives of green and sustainable development.…”