2001
DOI: 10.1063/1.1382835
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Computer simulation of void growth dynamics under the action of electromigration and capillary forces in narrow thin interconnects

Abstract: A comprehensive picture of void dynamics in connection with the critical morphological evolution has been developed in order to understand the conditions under which premature failure of metallic thin interconnects occurs. Our mathematical model on the mass flow and accumulation on void surfaces, under the action of applied electrostatic and elastostatic force fields, and capillary effects, follows an irreversible but discrete thermodynamic formulation of interphases and surfaces. This formalism also takes int… Show more

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Cited by 29 publications
(31 citation statements)
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“…The relevant parts are summarized in our recent publications (Ogurtani and Oren, 2001;Oren and Ogurtani, 2002). However in the first paper, the local entropy production or the entropy source term associated with the virtual displacement of an ordinary point is referred to unpublished work of Ogurtani (2000).…”
Section: Internal Entropy Productions Associated With the Virtual Dismentioning
confidence: 99%
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“…The relevant parts are summarized in our recent publications (Ogurtani and Oren, 2001;Oren and Ogurtani, 2002). However in the first paper, the local entropy production or the entropy source term associated with the virtual displacement of an ordinary point is referred to unpublished work of Ogurtani (2000).…”
Section: Internal Entropy Productions Associated With the Virtual Dismentioning
confidence: 99%
“…The set of forces and fluxes that is employed in our previous paper (Ogurtani and Oren, 2001) in connection with ordinary points along the void surface layer is based on thermodynamic considerations. However, the interpretation of these forces is rather abstract, and they may be also referred to as affinities in the field of irreversible thermodynamics.…”
Section: Internal Entropy Productions Associated With the Virtual Dismentioning
confidence: 99%
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