Conduction of Heat across Rectangular Cellular Enclosures

Abstract

A simplified analytical model for the computation of thermal conduction across rectangular-celled enclosures based on the assumption of quasi-one-dimensional conduction in the cell partitions is presented. The rectangular enclosures may contain solid or liquid for which the conduction is two or three-dimensional depending on the geometrical configuration. Additional assumptions concerning radiation interchange between participating surfaces are necessary when the enclosure contains a stagnant gas. This analytical model leads to a closed form solution for temperature distribution in the partitions and the multidimensional conductive region. A parametric study of heat flux is presented. The numerical data define a range of parameters for which a one-dimensional conduction model is satisfactory.