2004
DOI: 10.1016/j.jcrysgro.2004.08.129
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Control of epitaxial defects for optimal AlGaN/GaN HEMT performance and reliability

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Cited by 40 publications
(26 citation statements)
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“…͑For details of the nucleation layer, see a study about the impact of AlN nucleation conditions on the density and character of threading dislocations emanating from the on SiC substrates. 5 ͒ It is also possible that carbon could be incorporated into the unintentionally doped GaN buffer layer, making it highly resistive, but we have no direct evidence of that fact. Schottky dots of 130 m in diameter and ring-shaped Ohmic contacts surrounding the dots were fabricated on the surface using Ni/Au and Ti/Al/Ni/Au metallizations, respectively.…”
Section: Methodsmentioning
confidence: 89%
“…͑For details of the nucleation layer, see a study about the impact of AlN nucleation conditions on the density and character of threading dislocations emanating from the on SiC substrates. 5 ͒ It is also possible that carbon could be incorporated into the unintentionally doped GaN buffer layer, making it highly resistive, but we have no direct evidence of that fact. Schottky dots of 130 m in diameter and ring-shaped Ohmic contacts surrounding the dots were fabricated on the surface using Ni/Au and Ti/Al/Ni/Au metallizations, respectively.…”
Section: Methodsmentioning
confidence: 89%
“…Many efforts have been made in order to improve the crystalline quality of AlN and to decrease the dislocation density. [2][3][4][5][6][7][8][9] Nevertheless, the current crystalline quality of epitaxial AlN must be improved, particularly for UV LEDs and photodetectors.…”
mentioning
confidence: 99%
“…It has been reported that device performance is strongly related to dislocations, so the device design mitigates the influence of material imperfections [6]. The increase in dislocation density of AlN films is known to cause electron trapping in metal-insulator-semiconductor field-effect transistor (MISFET) devices [7]. An epitaxial AlN film grown on SiC (0 0 0 1) substrate is expected to reduce the dislocation density and electron trapping.…”
Section: Introductionmentioning
confidence: 99%