Controlling Pt nanoparticle sintering by sub-monolayer MgO ALD thin films

Zhang, Zhiwei; Filez, Matthias; Solano, Eduardo; Poonkottil, Nithin; Li, Jin; Minjauw, Matthias M.; Poelman, Hilde; Rosenthal, Martin; Brüner, Philipp; Galvita, Vladimir V.; Detavernier, Christophe; Dendooven, Jolien

doi:10.1039/d3nr05884k

Nanoscale

2024

DOI: 10.1039/d3nr05884k

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Controlling Pt nanoparticle sintering by sub-monolayer MgO ALD thin films

Zhiwei Zhang,

Matthias Filez,

Eduardo Solano

et al.

Abstract: Metal nanoparticle (NP) sintering is a major cause of catalyst deactivation, as NP growth reduces the surface area available for reaction. A promising route to halt sintering is to deposit...

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Low-Temperature Bonding for Heterogeneous Integration of Silicon Chips with Nanocrystalline Diamond Films

Lu,

Lv,

Zhang

et al. 2024

Micromachines

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Integrating nanocrystalline diamond (NCD) films on silicon chips has great practical significance and many potential applications, including high-power electronic devices, microelectromechanical systems, optoelectronic devices, and biosensors. In this study, we provide a solution for ensuring heterogeneous interface integration between silicon (Si) chips and NCD films using low-temperature bonding technology. This paper details the design and implementation of a magnetron sputtering layer on an NCD surface, as well as the materials and process for the connection layer of the integrated interface. The obtained NCD/Ti/Cu composite layer shows uniform island-like Cu nanostructures with 100~200 nm diameters, which could promote bonding between NCD and Si chips. Ultimately, a heterogeneous interface preparation of Si/Ag/Cu/Ti/NCD was achieved, with the integration temperature not exceeding 250 °C. The TEM analysis shows the closely packed atomic interface of the Cu NPs and deposited Ti/Cu layers, revealing the bonding mechanism.

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Low-Temperature Bonding for Heterogeneous Integration of Silicon Chips with Nanocrystalline Diamond Films

Lu,

Lv,

Zhang

et al. 2024

Micromachines

View full text Add to dashboard Cite

show abstract

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Controlling Pt nanoparticle sintering by sub-monolayer MgO ALD thin films

Abstract: Metal nanoparticle (NP) sintering is a major cause of catalyst deactivation, as NP growth reduces the surface area available for reaction. A promising route to halt sintering is to deposit...

Cited by 1 publication

References 47 publications

Low-Temperature Bonding for Heterogeneous Integration of Silicon Chips with Nanocrystalline Diamond Films

Low-Temperature Bonding for Heterogeneous Integration of Silicon Chips with Nanocrystalline Diamond Films

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