Cooling Performance of a Two-Phase (Vapor-Liquid) Flow-Cooling System

Abstract

Cooling capability is measured for a two-phase (vapor-liquid) flow-cooling system in terms of its thermal resistance and cooling power. The performance is compared between systems with and without a pump that drives the flow of a dielectric working fluid with a low boiling point. The geometry of the boiling chamber is first examined for each flow configuration to ensure the best possible performance. The results show that using a pump does not always result in higher power consumption than that of a thermal siphon system and the driving force generated by the pump augments phasechange heat transfer thereby reducing the fan power to minimize the overall power consumption. The present resultsshow that the flow-boiling system has a high cooling capability using a small amount of cooling power compared with the thermal siphon.