Copper Bonding Technology in Heterogeneous Integration

Lee, Yoon-Gu; McInerney, Michael J.; Joo, Young‐Chang; Choi, In‐Suk; Kim, Sarah Eunkyung

doi:10.1007/s13391-023-00433-4

Cited by 18 publications

(2 citation statements)

References 122 publications

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“…People have a higher pursuit of miniaturization and refinement of electronic products. However, the feature size of the chip is close to the manufacturing limit, and high-density three-dimensional stacked packaging technology is the inevitable trend of electronic packaging technology development [ [1] , [2] , [3] , [4] , [5] ]. There are more chips stack in the future development trend.…”

Section: Introductionmentioning

confidence: 99%

Solid-phase transient soldering method based on Au/Ni–W multilayer thin-film-modified copper-based structures

Xiao,

Zhai,

Luo

2024

Heliyon

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Section: Introductionmentioning

confidence: 99%

Solid-phase transient soldering method based on Au/Ni–W multilayer thin-film-modified copper-based structures

Xiao,

Zhai,

Luo

2024

Heliyon

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“…To meet this demand, designs and technologies that improve performance while reducing the size of semiconductor systems are necessary. However, the scaling down of individual components, such as unit transistors, has long reached the limits of the structure and fabrication processes [1][2][3]. To overcome this, packaging technologies and the development of backend-of-line (BEOL) structures are increasingly receiving attention [4][5][6][7].…”

Section: Introductionmentioning

confidence: 99%

Guidelines for Area Ratio between Metal Lines and Vias to Improve the Reliability of Interconnect Systems in High-Density Electronic Devices

Hong,

Kim,

Park

et al. 2023

Electronics

Self Cite

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This research was conducted in the context of the semiconductor market, with a demand for high-performance and highly integrated semiconductor systems that simultaneously enhance performance and reduce chip size. Scaling down the metal line and via in back-end-of-line (BEOL) structures is essential to efficiently deliver power to scaling down devices. This study utilized the finite element method (FEM) simulation technique to model the heat and current distribution for enhancing the efficiency of scaled-down structures. Due to current flow bottlenecks, an increase in the area ratio of the via to metal line (as the via becomes relatively smaller) leads to a temperature rise due to Joule heating. This trend follows a second-degree polynomial form, and the point where the temperature doubles compared to when the area ratio is one is situated at an area ratio of three. The temperature increase caused by Joule heating ultimately leads to destruction of the via, which directly affects the reliability of the BEOL structure. These experimental results can provide guidelines for designing with reliability considerations in mind, particularly in today’s semiconductor systems where significant scaling down is required in interconnect structures. They can also be widely applied to research aimed at developing interconnect structures that enhance reliability.

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Integration of microfluidic chips with biosensors

Sekhwama,

Mpofu,

Sudesh

et al. 2024

Discov Appl Sci

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The potential threat posed by disease outbreaks to diagnostic instruments demands the development of more effective biosensor technologies to counteract the risks. Diseases like SARS-CoV-2, Ebola, malaria, cholera, and many more have demonstrated beyond the limits of health care that new advancements are required for early detection and diagnosis. The rising number of diseases outbreaks has led to an increasing demand for biosensors that are more effective and quicker to utilize in healthcare settings. A biosensor incorporated with microfluidic chips offers an improved detection compared to traditional or classical biosensors. Microfluidic chips improve the performance of the biosensors by allowing automation, mixing, separation, throughput processing, and transport of the analytes to desired reactors. A biosensor incorporated with a microfluidic chip has improved sensitivity, easy operation and can use small volumes of samples to process the results. The effectiveness of biosensors depends also on the materials used in its fabrication and there are many materials used for fabrication which are reviewed in this work. This paper reviews the potential advantages of the use of microfluidic chips to enhance the performance of biosensors, materials used to fabricate the chips, and potential electrodes incorporated into microfluidic chips which improve the detection time by shortening the processing time for biosensors at the point of care service. This work also reviews new technologies which are not previously addressed other reviews including, integration of cell-imprinted polymers with microfluidic sensors and delved into future technologies outlook.

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Copper Bonding Technology in Heterogeneous Integration

Cited by 18 publications

References 122 publications

Solid-phase transient soldering method based on Au/Ni–W multilayer thin-film-modified copper-based structures

Solid-phase transient soldering method based on Au/Ni–W multilayer thin-film-modified copper-based structures

Guidelines for Area Ratio between Metal Lines and Vias to Improve the Reliability of Interconnect Systems in High-Density Electronic Devices

Integration of microfluidic chips with biosensors

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