1979
DOI: 10.1088/0022-3727/12/11/020
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Copper diffusion and photovoltaic mechanisms at Cu-CdS contact

Abstract: Schottky barriers have been formed by vacuum evaporation of Cu on to CdS thin films. The behaviour of these samples has been investigated as a function of time and annealing by standard electrical methods: current-voltage analysis, capacitance-voltage analysis and analysis of the spectral dependence of the photoemission currents. The impurity profile deduced from the reverse differential capacitance shows evidence of copper diffusion occurring between 20 and 200 degrees C. An activation energy of 0.72 eV is fo… Show more

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Cited by 12 publications
(8 citation statements)
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“…It is known that the height of the barrier increases if there are surface states [29]. The sample produced at 200 K substrate temperature has smaller particle size compared to the sample produced at 300 K substrate temperature, which causes higher grain boundaries and therefore surface states [33]. Saturation current values were found to be the lowest in the heterojunction produced at 200 K substrate temperature.…”
Section: Resultsmentioning
confidence: 93%
See 1 more Smart Citation
“…It is known that the height of the barrier increases if there are surface states [29]. The sample produced at 200 K substrate temperature has smaller particle size compared to the sample produced at 300 K substrate temperature, which causes higher grain boundaries and therefore surface states [33]. Saturation current values were found to be the lowest in the heterojunction produced at 200 K substrate temperature.…”
Section: Resultsmentioning
confidence: 93%
“…where A * is the theoretical Richardson constant (23 A cm −2 K −2 for CdS) [33], A is the diode area (A = 0.07 cm 2 ) and ϕ b is the zero bias barrier height. ϕ b is calculated by the following formula,…”
Section: Resultsmentioning
confidence: 99%
“…We consider here the diffusion of Cd, Cl, S, Te and Cu interstitials and vacancies of Cd and S. Detailed structural information provided here can only be obtained from reliable DFT computations. It is complementary to results of experimental observations where activation energies are measured indirectly leading to deduction of diffusion barriers [32][33][34][35][36][37][38][39][40][41][42]. The interstitial diffusion paths considered in this work were chosen parallel to c-axis.…”
Section: Interstitial Diffusionmentioning
confidence: 90%
“…The 0.66 eV value for Cu is in good agreement with experiment. The range of experimental values can be attributed to the different techniques used to determine the barriers including capacitive measurements [32,33], tracer [34] and optical absorption technique [35]. The calculated diffusion barrier for a Cl interstitial of 0.76 eV is large and this should be viewed as an upper bound for what can happen for diffusion in non-ideal crystals with planar defects such as grain boundaries.…”
Section: Diffusion Barrier and Strain Energymentioning
confidence: 99%
“…Експериментально виявлено [3][4][5], що хімічні методи отримання сульфіду міді, які базуються на реакції заміщення на поверхні сульфіду кадмію призводять до формування нестехіометричної сполуки Cu x S. В залежності від умов проведення реакції величина х може змінюватися від 1 до 2. Відомо, що при кімнатній температурі існують кілька стабільних фаз сульфіду міді: халькоцит -Cu 2 S; дьюрліт -Cu 1.96 S; дігенит -Cu 1.8 S; аніліт -Cu 1.75 S; ковеліт -CuS.…”
Section: дифрактометричний аналізunclassified