Copper Nanoparticle/Multiwalled Carbon Nanotube Composite Films with High Electrical Conductivity and Fatigue Resistance Fabricated via Flash Light Sintering

Hwang, Hyun Jun; Joo, Sung Jun; Kim, Kwang Ho

doi:10.1021/acsami.5b08112

Cited by 67 publications

(28 citation statements)

References 37 publications

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“…Besides, the oxidation problem, as seen in Cu NWs, is neglectable for CNTs. Hwang et al employed multiwalled CNTs (MWCNTs) to improve the conductivity and fatigue resistance of IPL-sintered Cu nanoparticle films [ 152 ]. The Cu nanoparticle/MWCNT (CNT length = 200 μm, 0.5 wt%) composite films were fabricated via optimized flashlight irradiation (flashlight = 15 J/cm 2 , 1 pulse, 10 ms) ( Figure 20 a–c), and exhibited the lowest resistivity (7.86 μΩ·cm).…”

Section: Formulation Designs In Cu-based Mixed Inks/pastesmentioning

confidence: 99%

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Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Tomotoshi

Kawasaki

2020

Nanomaterials

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Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effective and abundant, as compared to Ag. Moreover, the migration tendency of Cu is less than that of Ag. Thus, recently, Cu-based inks/pastes have gained increasing attention as conductive inks/pastes for printed/flexible electronics. However, the disadvantages of Cu-based inks/pastes are their instability against oxidation under an ambient condition and tendency to form insulating layers of Cu oxide, such as cuprous oxide (Cu2O) and cupric oxide (CuO). The formation of the Cu oxidation causes a low conductivity in sintered Cu films and interferes with the sintering of Cu particles. In this review, we summarize the surface and interface designs for Cu-based conductive inks/pastes, in which the strategies for the oxidation resistance of Cu and low-temperature sintering are applied to produce highly conductive Cu patterns/electrodes on flexible substrates. First, we classify the Cu-based inks/pastes and briefly describe the surface oxidation behaviors of Cu. Next, we describe various surface control approaches for Cu-based inks/pastes to achieve both the oxidation resistance and low-temperature sintering to produce highly conductive Cu patterns/electrodes on flexible substrates. These surface control approaches include surface designs by polymers, small ligands, core-shell structures, and surface activation. Recently developed Cu-based mixed inks/pastes are also described, and the synergy effect in the mixed inks/pastes offers improved performances compared with the single use of each component. Finally, we offer our perspectives on Cu-based inks/pastes for future efforts.

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Section: Formulation Designs In Cu-based Mixed Inks/pastesmentioning

confidence: 99%

“…( e ) The SEM images of the fatigue-tested Cu nanoparticle/CNT composite films after 1000-cycle bending fatigue test of 0.5 wt% CNTs. Reprinted with permission from reference [ 152 ], Copyright American Chemical Society, 2015.…”

Section: Figurementioning

confidence: 99%

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Tomotoshi

Kawasaki

2020

Nanomaterials

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“…[13], CNT-metal composites were produced onto a Kapton polyimide film through aerosol-jet printing followed by furnace sintering, while Ref. [14] reported research work on the fabrication of CNT-metal composite films onto a polyimide substrate through flash light sintering.…”

Section: Introductionmentioning

confidence: 99%

Laser-Based Fabrication of Carbon Nanotube–Silver Composites With Enhanced Fatigue Performance Onto a Flexible Substrate

Kang

Wang

et al. 2018

Journal of Manufacturing Science and Engineering

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Flexible electronic devices involve electronic circuits fabricated onto a flexible (e.g., polymer) substrate, and they have many important applications. However, during their use, they often need to go through repeated deformations (such as bending). This may generate cracks in metallic components that often exist in a flexible electronic device and could obviously affect the device durability and reliability. Carbon nanotubes (CNTs) have a potential to enhance the metal fatigue properties. However, the previous work on the fabrication of CNT–metal composites onto a flexible substrate has been limited. This paper reports the research work on a novel laser-based approach to fabricate CNT–metal composites onto a flexible substrate, where mixtures containing CNTs and metal (silver) nanoparticles (NPs) are deposited onto the substrate through a dispensing device and then laser-sintered into CNT–metal composites. Under the studied conditions and for the tested samples, it has been found that overall the addition of CNTs has significantly enhanced the bending fatigue properties of the laser-sintered material without degrading the material electrical conductivity (which has actually been slightly increased). The laser-based approach has several potential advantages, such as the local, precise, and flexible production of CNT–metal composite patterns with small or little thermal effects to the flexible substrate and other surrounding regions, and without using a mask or vacuum. Future work is certainly still needed on this novel fabrication process.

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“…More recently, besides low‐temperature sintering of Cu‐based inks, ensuring the durability of sintered Cu films to safeguard their environmental stability and mechanical flexibility has become the most important task from a practical standpoint . The mechanical properties of sintered Cu films on flexible substrates are an important factor of their practical application to flexible devices.…”

Section: Introductionmentioning

confidence: 99%

“…Unfortunately, nanoparticle‐based inks cause many problems regarding mechanical cracking in the joints of sintered nanoparticle films, which result in low durability of sintered copper films under repetitive bending. Some approaches have been proposed to increase the mechanical durability of the sintered copper film by mixing other fillers such as carbon nanotubes (CNTs) and nanowires (NWs) . However, the use of CNTs and NWs is often plagued by aggregation of fillers.…”

Section: Introductionmentioning

confidence: 99%

Contribution of Ligand Oxidation Products to High Durability of Copper Films Prepared from Low‐Sintering‐Temperature Copper Ink on Polymer Substrates

2017

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In electronic printing, ensuring high durability of sintered copper films on flexible substrates to obtain environmental stability and mechanical flexibility has become the most important task from a practical standpoint. In the study reported here, the authors develop solution synthesis of 2‐amino‐2‐ethyl‐1,3‐propanediol (AEP)‐protected copper nanoparticles (AEP–Cu NPs) with sizes of 3–8 nm in ethylene glycol, where the Cu NPs are stabilized via the metallacyclic coordination stability of the AEP ligands. The sintered Cu film exhibits a resistivity of 50 μΩ cm−1 after heating at 150 °C under a nitrogen atmosphere. Most importantly, the resulting Cu films on the polyethylene terephthalate (PET) substrates show excellent durability in terms of bending and adhesion without requiring any additives like nanotubes and nanowires. Furthermore, the authors successfully demonstrated the high environmental stability of the resulting Cu film even after it is exposed to harsh environmental conditions (RH 80%, 60 °C) for 1 month. The environmental durability is further improved by utilizing a composite ink of AEP–Cu NPs with copper microflakes. It is experimentally proven that oxidation products from AEP ligands originating in the sintering process contributed to the high durability of sintered copper films on flexible substrates.

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Copper Nanoparticle/Multiwalled Carbon Nanotube Composite Films with High Electrical Conductivity and Fatigue Resistance Fabricated via Flash Light Sintering

Cited by 67 publications

References 37 publications

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Laser-Based Fabrication of Carbon Nanotube–Silver Composites With Enhanced Fatigue Performance Onto a Flexible Substrate

Contribution of Ligand Oxidation Products to High Durability of Copper Films Prepared from Low‐Sintering‐Temperature Copper Ink on Polymer Substrates

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