Correction to: Metabolic engineering of Yarrowia lipolytica for thermoresistance and enhanced erythritol productivity

Abstract

An amendment to this paper has been published and can be accessed via the original article.

Discovery and Functional Evaluation of Heat Tolerance Genes in the Nonconventional Yeast Yarrowia lipolytica

“…The engineered strain T.te-Gros2 showed the best thermotolerance when cultured at 42 • C for 72 h. Notably, Liang et al [35] introduced potential thermotolerance genes that encode Hsps, stress response proteins, ATPases, ubiquitin ligases, antioxidant enzymes, and nucleic acid protectors into Y. lipolytica. The results showed that expression of Hsp10, San1, and Ctt1 enhanced the growth of Y. lipolytica at 35 • C. Additionally, Wang et al [36] and Hosein Shahsavarani et al [33] overexpressed Rsp5 in Y. lipolytica and S. cerevisiae, respectively, which contributed to the increase in the upper limit of yeast thermotolerance. This is because Rsp5 is an essential gene encoding E3 ubiquitin-protein ligase, which improves heat resistance by targeting cytosolic misfolded proteins following heat stress in yeast [42].…”

“…Based on the mechanism of yeast thermoresistance, some heat-resistant devices have been introduced into Y. lipolytica to improve its thermoresistance [35,36]; however, there are a limited number of heat-resistant devices that could be used. Thus, it is crucial to develop new heat-resistant devices that can be applied to improve the thermoduric capacity of Y. lipolytica.…”