1995
DOI: 10.1007/s003390050241
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CoSi2 formation in contact systems based on Ti?Co alloy with low cobalt content

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“…Such surface modifications permit improvement of the endurance of Ti6Al4V alloy due to the formation of hard Ti-Co intermetallic particles. The Ti–Co thin films were used also as diffusion barriers, or as an element of integrated circuits [24,25].…”
Section: Introductionmentioning
confidence: 99%
“…Such surface modifications permit improvement of the endurance of Ti6Al4V alloy due to the formation of hard Ti-Co intermetallic particles. The Ti–Co thin films were used also as diffusion barriers, or as an element of integrated circuits [24,25].…”
Section: Introductionmentioning
confidence: 99%